Interfacial thermal resistance: Past, present, and future

Chen, Jie1; Xu, Xiangfan1; Zhou, Jun2; Li, Baowen3,4,5

2022-04-22

10.1103/RevModPhys.94.025002

REVIEWS OF MODERN PHYSICS   Impact Factor & Quartile

0034-6861

1539-0756

Interfacial thermal resistance (ITR) is the main obstacle for heat flows from one material to another. Understanding ITR becomes essential for the removal of redundant heat from fast and powerful electronic and photonic devices, batteries, etc. In this review, a comprehensive examination of ITR is conducted. Particular focus is placed on the theoretical, computational, and experimental developments in the 30 years after the last review given by Swartz and Pohl in 1989. To be self-consistent, the fundamental theories, such as the acoustic mismatch model, the diffuse mismatch model, and the two-temperature model, are reviewed. The most popular computational methods, including lattice dynamics, molecular dynamics, the Green???s function method, and the Boltzmann transport equation method, are discussed in detail. Various experimental tools in probing ITR, such as the time-domain thermoreflectance, the thermal bridge method, the 3?? method, and the electron-beam self-heating method, are illustrated. This review covers ITR (also known as the thermal boundary resistance or Kapitza resistance) of solid-solid, solidliquid, and solid-gas interfaces. Such fundamental challenges as how to define the interface, temperature, etc. when the materials scale down to the nanoscale or atomic scale and the opportunities for future studies are also pointed out.

SCI ; EI

English

ESI Hot Papers ; ESI Highly Cited Papers ; ESI Highly Cited Papers ; ESI Highly Cited Papers ; ESI Highly Cited Papers ; ESI Highly Cited Papers ; ESI Highly Cited Papers ; ESI Highly Cited Papers ; ESI Highly Cited Papers

Others

National Natural Science Foundation of China[12174286,11890703,11334007,12075168] ; National Key R&D Program of China[2017YFB0406004] ; Science and Technology Commission of Shanghai Municipality[19ZR1478600] ; Key-Area Research and Development Program of Guangdong Province["2020B0303060001","2020B010190004"]

Physics

Physics, Multidisciplinary

WOS:000796395200001

AMER PHYSICAL SOC

20222112137282

Boltzmann equation ; Computation theory ; Computational chemistry ; Crystal lattices ; Heat resistance ; Molecular dynamics ; Phase interfaces ; Time domain analysis

Computer Theory, Includes Formal Logic, Automata Theory, Switching Theory, Programming Theory:721.1 ; Light/Optics:741.1 ; Optical Devices and Systems:741.3 ; Chemistry:801 ; Physical Chemistry:801.4 ; Mathematics:921 ; Numerical Methods:921.6 ; Statistical Methods:922 ; Crystal Lattice:933.1.1

PHYSICS

Web of Science

1.Tongji Univ, Ctr Phonon & Thermal Energy Sci, China EU Joint Lab Nanophonon, MOE Key Lab Adv Microstruct Mat,Sch Phys Sci & En, Shanghai 200092, Peoples R China
2.Nanjing Normal Univ, Sch Phys & Technol, Phonon Engn Res Ctr Jiangsu Prov, Ctr Quantum Transport & Thermal Energy Sci,Inst P, Nanjing 210023, Peoples R China
3.Southern Univ Sci & Technol, Shenzhen Inst Quantum Sci & Engn, Dept Mat Sci & Engn, Dept Phys, Shenzhen 518055, Peoples R China
4.Univ Colorado, Paul M Rady Dept Mech Engn, Boulder, CO 80305 USA
5.Univ Colorado, Dept Phys, Boulder, CO 80305 USA

Chen, Jie,Xu, Xiangfan,Zhou, Jun,et al. Interfacial thermal resistance: Past, present, and future[J]. REVIEWS OF MODERN PHYSICS,2022,94(2).

Chen, Jie,Xu, Xiangfan,Zhou, Jun,&Li, Baowen.(2022).Interfacial thermal resistance: Past, present, and future.REVIEWS OF MODERN PHYSICS,94(2).

Chen, Jie,et al."Interfacial thermal resistance: Past, present, and future".REVIEWS OF MODERN PHYSICS 94.2(2022).