基于瞬态电热技术的石墨烯纤维热输运特性调控和机理研究

随着集成电路的高集成化和高功率化，散热问题已成为制约先进微电子制造业发展的瓶颈问题之一。然而相对于层出不穷的新型热管理材料，相关的导热机理研究受限于导热性能表征严格的实验条件，进展缓慢。在传热领域的研究中，理解和设计材料的热导率一直是工程热物理中的一项长期挑战。本文基于一种瞬态电热测量技术对石墨烯纤维热扩散系数的表征，通过声子散射机理分析，研究不同退火还原工艺下石墨烯纤维的变化规律，进而实现对石墨烯纤维性能的调控。同时，研究了两种不同工艺的石墨烯纤维膜的热扩散系数，并探究其传热机制。

首先，本文采用高温退火调控还原氧化石墨烯纤维性能，通过控制不同退火温度，得到具有不同导热导电性能的石墨烯纤维，研究其性能变化规律及机理。Raman光谱结果显示更高的退火温度可以去除含氧官能团，消除结构缺陷，改善晶粒尺寸，因此随着退火温度提高，声子运输的平均自由程增大。并且采取适当的退火工艺，可使部分还原氧化石墨烯纤维具有良好的热辐射敏感度。

进一步，本文采用焦耳退火替代高温退火细化调控过程，相比于高温退火，焦耳退火效率更高，耗时更短。随着退火电流增大，由于前一次退火中部分无序结构转变为有序结构，后一次退火时间会较前一次退火有所缩短。研究了经退火达到较高石墨化程度的部分还原氧化石墨烯纤维的热扩散系数在低温下的变化规律，其在低温下因Umklapp散射、缺陷散射与边界散射对热传导影响比重的改变，会出现非单调性的变化趋势。

最后，使用瞬态电热技术表征了两种使用不同工艺制备的石墨烯纤维膜的热扩散系数并进一步探究其传热机制。一系列形貌与结构表征显示造成两者传热能力差别的微观原因为晶粒取向，宏观原因为石墨烯纤维的排布取向。引入阻温系数的概念揭示了导致两种石墨烯纤维膜热性能差异的另一个原因是缺陷程度，缺陷程度更高的材料会具有更低的热扩散系数。

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