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0856 材料与化工
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0856 材料与化工
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  随着5G 时代的到来和智能电子产品的快速发展,数字电路对集约化和高密度的性能要求提高,伴随着信号传输频率朝着高频频带的偏移,急速增加的传播速率会带来层间寄生电容、阻抗和线间串扰等缺陷,同时需要满足巨大的信号吞吐量。为了解决这些问题,印刷电路覆铜板层间介质材料必须具有较低的介电常数(Dk)和介电损耗(Df)。环氧树脂是印刷电路板(PCB)领域中应用最广泛的聚合物材料。然而,其高介电常数和高介电损耗不能满足高频高速 IC 封装基材中先进封装材料的要求。
  本研究以增加环氧体系自由体积作为出发点,从固化剂分子结构改性入手,设计、合成了一种新型芳香二胺单体 TTSA,通过引入极性低、刚性强的非共平面分子结构单元(“螺中心”结构)来增大聚合物的分子自由体积,从而改善环氧树脂的介电性能。本文对不同固化体系的固化反应动力学进行了研究,确定了最佳的固化条件,制备了相应的环氧树脂薄膜材料,建立了固化剂的分子结构与环氧基材料的热力学性能和高频介电性能之间的关系。环氧薄膜材料具有优异的热稳定性和力学性能(失重 5%的热降解温度(Td5wt%):357℃Ar);耐热指数:190℃;玻璃化转变温度(Tg217℃),同时在 5 GHz 下显示着良好的低介电常数(Dk2.91)和介电损耗值(Df0.02)。此外,该树脂的吸水率低至 0.64%,满足电介质材料的要求。这些结果表明新型固化剂TTSA 为改性环氧树脂提供了一种新的途径,在高性能印制线路板基材中具有应用值。
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王刚. 电子封装用低介电环氧树脂固化剂的合成及性能研究[D]. 深圳. 南方科技大学,2022.
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