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Name pinyin
LI Yulong
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0856 材料与化工
Subject category of dissertation
0856 材料与化工
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    With the development of electronic information technology and social needs, miniaturization, lightweight, high-performance, low-cost are the mainstream of electronic products, in addition to the need for a higher integration of IC design, electronic packaging technology is also playing an important role. According to the different materials used, electronic packaging can be divided into metal packaging, ceramic packaging and plastic packaging. In recent years, plastic packaging with its lower cost, simple process, suitable for mass production and other advantages, has a strong vitality and market adaptability. It has developed rapidly since its birth and has gradually become the mainstream of civil electronic device packaging. At present, epoxy molding compound is the most commonly used plastic packaging material, in order to provide protection for chip and solder ball, and it needs to withstand multi-physical stress. Therefore, the reliability assessment during the encapsulation process is very important, but most reliability tests are destructive, which result in high cost. Therefore, the combination of reliability test and finite element simulation can be said to be an effective method to explore the internal mechanism of the failure of packaging structure.

    This paper will mainly study the reliability of epoxy plastic packaging structure based on finite element simulation, which mainly includes two aspects: structural optimization of thermal stress simulation and mold flow simulation. For the structural optimization of thermal stress simulation, the design of experiment based on statistical theory was analyzed, and the selected 4-factor 2-level scheme was analyzed by using this method. It was found that according to the selected levels, the four factors all had significant influence on the thermal stress of epoxy plastic packaging structure, they were Young's modulus of epoxy molding compound, Young's modulus of the substrate, CTE of epoxy molding compound and CTE of the substrate. For the mold flow simulation, the transfer molding process and the bottom filling process were mainly studied. In the transfer molding process, the selection of epoxy molding compound with lower dynamic viscosity and slower curing rate under liquid state, and the appropriate mold temperature and filling time setting will benefit the mold flow filling. In the bottom filling process, appropriate dotting form, reasonable solder ball layout and chip edge size, and epoxy molding compound with lower dynamic viscosity and better wettability under liquid state can achieve better filling results. In addition, adjusting the dotting path length can effectively improve the racing effect. The research results can be used as references for material selection and production design of plastic packaging.

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References List

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李宇龙. 基于有限元仿真的环氧塑封可靠性研究[D]. 深圳. 南方科技大学,2022.
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