基于SBS嵌段共聚物的电磁屏蔽复合材料制备与性能研究

自十九世纪以来，基于法拉第、麦克斯韦、赫兹等众多科学家对电磁学的不断研究，电磁波开始在人类社会中占据愈加重要的地位，并被广泛运用于通讯、探测、医疗等诸多领域，随之而来的是越来越严重的电磁辐射污染问题。其中，高频率、大功率的电磁辐射会干扰电子设备的正常运行，也会对人的身体健康产生潜在影响，而对电磁波进行衰减和屏蔽可以有效减少其危害，因此，作为解决这一系列问题最为有效手段的电磁屏蔽材料应运而生。尤其是随着新一代智能电子设备，如智能手机、平板电脑、可穿戴设备的快速发展，电子设备不断朝着小型化、轻质化、柔性化的方向迈进，聚合物基导电复合材料（Conductive Polymer Composites，CPCs）凭借其易加工、易调控、适用性广等优点，在电磁屏蔽领域得到了越来越多的关注与研究。

聚合物基导电复合材料按结构特征可主要分为填充复合型和表面导电型两种。填充复合型CPCs材料的导电填料相对均匀地分布在复合材料内部，这种复合材料的整体导电性较好，但往往需要较高的填料含量来构筑三维的导电网络；表面导电型CPCs材料往往通过溅射、喷涂、化学镀、电镀等手段实现在聚合物基体表面包覆金属涂层，能够在较低负载量下实现较高的导电和屏蔽性能，然而其聚合物基底与金属涂层间的结合力差，在形变时容易出现断裂和脱落等现象，限制了表面导电型CPCs在电磁屏蔽领域的应用。本论文的主要工作旨在增强聚合物基体与金属导电层的界面结合力，选用苯乙烯-丁二烯-苯乙烯嵌段共聚物（SBS）作为聚合物基体，利用SBS与银盐溶液的表界面浸润作用，实现金属银（Ag）涂层在聚合物界面的微嵌入，提升金属层与聚合物基体间的结合力，并系统研究了Ag/SBS复合薄膜的金属层结构、力学性能、导电性能及电磁屏蔽性能之间的关系。论文的主要研究内容如下：

（1）将SBS薄膜浸润在银盐溶液中，通过原位还原法对SBS薄膜表面的银盐进行化学还原，从而实现SBS薄膜表面的银（Ag）金属化，制备了具有良好导电性的Ag/SBS电磁屏蔽复合薄膜材料，并探究了使复合薄膜获得良好导电及电磁屏蔽性能所需的最佳还原条件及还原次数。Ag/SBS复合薄膜表层的银纳米颗粒（AgNPs）能够实现在SBS表面的微嵌入，提升镀层与SBS的界面结合力。在经过3次还原后，复合薄膜的Ag负载量为37.5 wt%，电导率高达1.1×10⁴ S/m，在X波段的电磁屏蔽效能（EMI SE）高达80.2 dB，且在50%的拉伸应变下仍具有20.4 dB的电磁屏蔽效能。

（2）以SBS薄膜为基体，对预拉伸状态的SBS薄膜进行Ag金属化并松弛，获得了具有褶皱结构Ag导电层的Ag/SBS复合薄膜。预拉伸状态下的SBS薄膜比较面积提升，有效提升了还原效率，褶皱状结构的Ag导电层极大增强了复合薄膜的拉伸导电稳定性及电磁屏蔽效能稳定性。经过1次原位还原的100%预拉伸Ag/SBS薄膜具有1.5×10⁴ S/m的高电导率，X波段下的EMI SE可达88.3 dB，特别是在100%的拉伸应变下EMI SE仍高达51.5 dB。

（3）以SBS为基体，引入具有高长径比的碳纳米纤维（CNF）作为导电填料，制备了具有良好拉伸导电稳定性的CNF/SBS复合薄膜，并对其进行Ag金属化，得到具有优异电磁屏蔽性能和良好拉伸导电稳定性的Ag/CNF/SBS复合薄膜。CNF的加入构建了连通上下Ag导电层的导电网络，增强了薄膜整体的导电性，CNF质量分数为15 wt%的Ag/CNF/SBS复合薄膜的电导率达到了2.5×10⁴ S/m，在X波段的EMI SE高达102.3 dB。同时，由于CNF高长径比的特性，可在拉伸时保证薄膜的电磁屏蔽性能，上述薄膜在100%拉伸应变下仍具有33.4 dB的电磁屏蔽效能。

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