Multilayer Perceptron Based Stress Evolution Analysis under DC Current Stressing for Multi-segment Wires

Tianshu Hou1; Peining Zhen1; Ngai Wong2; Quan Chen3; Guoyong Shi1; Shuqi Wang1; Hai-Bao Chen1

2022

10.1109/TCAD.2022.3176545

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems   Impact Factor & Quartile

1937-4151

1937-4151

Electromigration (EM) is one of the major concerns in the reliability analysis of very large-scale integration (VLSI) systems due to the continuous technology scaling. Accurately predicting the time-to-failure of integrated circuits (ICs) becomes increasingly important for modern IC design. However, traditional methods are often not sufficiently accurate, leading to undesirable over-design especially in advanced technology nodes. In this article, we propose an approach using multilayer perceptrons (MLPs) to compute stress evolution in the interconnect trees during the void nucleation phase. The availability of a customized trial function for neural network training holds the promise of finding dynamic mesh-free stress evolution on complex interconnect trees under time-varying temperatures. Specifically, we formulate a new objective function considering the EM-induced coupled partial differential equations (PDEs), boundary conditions (BCs), and initial conditions to enforce the physics-based constraints in the spatial-temporal domain. The proposed model avoids meshing and reduces temporal iterations compared with conventional numerical approaches like finite element method. Numerical results confirm its advantages on accuracy and computational performance.

Electromigration trial function complex interconnect tree multilayer perceptron dynamic temperature.

EI ; SCI

English

Others

National Key Research and Development Program of China[2019YFB2205005] ; Natural Science Foundation of China (NSFC)[62034007]

Computer Science ; Engineering

Computer Science, Hardware & Architecture ; Computer Science, Interdisciplinary Applications ; Engineering, Electrical & Electronic

WOS:000920768600017

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

20222112149677

Boundary conditions ; Complex networks ; Electromigration ; Forestry ; Integrated circuit design ; Integrated circuit interconnects ; Multilayer neural networks ; Multilayers ; Reliability analysis ; VLSI circuits

Electricity: Basic Concepts and Phenomena:701.1 ; Pulse Circuits:713.4 ; Semiconductor Devices and Integrated Circuits:714.2 ; Computer Systems and Equipment:722 ; Woodlands and Forestry:821.0

IEEE

1.Department of Micro/Nano Electronics, Shanghai Jiao Tong University.
2.Department of Electrical and Electronic Engineering, University of Hong Kong.
3.School of Microelectronics, Southern University of Science and Technology.

Tianshu Hou,Peining Zhen,Ngai Wong,et al. Multilayer Perceptron Based Stress Evolution Analysis under DC Current Stressing for Multi-segment Wires[J]. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems,2022,PP(99):1-1.

Tianshu Hou.,Peining Zhen.,Ngai Wong.,Quan Chen.,Guoyong Shi.,...&Hai-Bao Chen.(2022).Multilayer Perceptron Based Stress Evolution Analysis under DC Current Stressing for Multi-segment Wires.IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems,PP(99),1-1.

Tianshu Hou,et al."Multilayer Perceptron Based Stress Evolution Analysis under DC Current Stressing for Multi-segment Wires".IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems PP.99(2022):1-1.