中文版 | English
Title

Effects of interfacial bonding strength on the formation of conductive anodic filament in polyphenylene oxide/glass fiber laminates

Author
Corresponding AuthorWu,Hailong; Wang,Ke
Publication Years
2022-08-01
DOI
Source Title
ISSN
0026-2714
EISSN
1872-941X
Volume135
Abstract

The formation of conductive anodic filament (CAF) inside printed circuit boards (PCBs) is one of the major failure modes related to the long-term reliability of electronic devices. In this paper, the relationship between susceptibility to CAF formation and glass fiber/resin interfacial bonding strength of a thermosetting polyphenylene oxide (PPO)/glass fiber composite system was investigated. Laminates with different interfacial bonding strengths were prepared by coating glass fibers with different silane coupling agents. Interlaminar shear strength (ILSS) of the PPO composites with silane-treated glass fibers has been improved by around 30 %, compared to the PPO/glass fiber composite without silane treatment. An accelerated response to CAF susceptibility was realized by substantially reducing the hole wall to hole wall distance of PCB to 5mil and 7 mil. By correlating the test results of interlaminar shear strength, haloing effect and susceptibility to CAF formation, it is confirmed that the CAF resistance of PCBs is positively correlated with the glass fiber/resin interfacial bonding strength.

Keywords
URL[Source Record]
Indexed By
SCI ; EI
Language
English
SUSTech Authorship
First ; Corresponding
Funding Project
Guangdong Science and Technology Department[2020B010175001]
WOS Research Area
Engineering ; Science & Technology - Other Topics ; Physics
WOS Subject
Engineering, Electrical & Electronic ; Nanoscience & Nanotechnology ; Physics, Applied
WOS Accession No
WOS:000838216000001
Publisher
EI Accession Number
20222912376517
EI Keywords
Adhesives ; Diffusion Bonding ; Fiber Bonding ; Glass Bonding ; Glass Fibers ; Shear Flow ; Shear Strength ; Timing Circuits
ESI Classification Code
Biomedical Engineering:461.1 ; Fluid Flow, General:631.1 ; Pulse Circuits:713.4 ; Glass:812.3
ESI Research Field
ENGINEERING
Scopus EID
2-s2.0-85134256136
Data Source
Scopus
Citation statistics
Cited Times [WOS]:2
Document TypeJournal Article
Identifierhttp://kc.sustech.edu.cn/handle/2SGJ60CL/356226
DepartmentSchool of System Design and Intelligent Manufacturing
Affiliation
1.School of System Design and Intelligent Manufacturing,Southern University of Science and Technology,Shenzhen,1088 Xueyuan Avenue, Nanshan District,518055,China
2.National Engineering Research Center of Electronic Circuits Base Materials,Shengyi Technology Co.,Ltd,Dongguan,No. 5, West Industry Road, Songshan Lake Sci. & Tech. Industry Park,523000,China
First Author AffilicationSchool of System Design and Intelligent Manufacturing
Corresponding Author AffilicationSchool of System Design and Intelligent Manufacturing
First Author's First AffilicationSchool of System Design and Intelligent Manufacturing
Recommended Citation
GB/T 7714
Wang,Zhongwei,Fang,Zeming,Wu,Hailong,et al. Effects of interfacial bonding strength on the formation of conductive anodic filament in polyphenylene oxide/glass fiber laminates[J]. MICROELECTRONICS RELIABILITY,2022,135.
APA
Wang,Zhongwei.,Fang,Zeming.,Wu,Hailong.,Liu,Qianfa.,Li,Yuan.,...&Wang,Ke.(2022).Effects of interfacial bonding strength on the formation of conductive anodic filament in polyphenylene oxide/glass fiber laminates.MICROELECTRONICS RELIABILITY,135.
MLA
Wang,Zhongwei,et al."Effects of interfacial bonding strength on the formation of conductive anodic filament in polyphenylene oxide/glass fiber laminates".MICROELECTRONICS RELIABILITY 135(2022).
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