| Title | Pressureless In-air Sintered Silver Bonding Bare Silicon Die on Silver-metallized Heat Spreader |
| Author | |
| DOI | |
| Publication Years | 2022
|
| ISBN | 978-1-6654-9906-4
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| Source Title | |
| Pages | 1-4
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| Conference Date | 10-13 Aug. 2022
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| Conference Place | Dalian, China
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| Keywords | |
| SUSTech Authorship | First
|
| URL | [Source Record] |
| Data Source | IEEE
|
| PDF url | https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9872695 |
| Citation statistics |
Cited Times [WOS]:0
|
| Document Type | Conference paper |
| Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/401516 |
| Department | SUSTech Institute of Microelectronics |
| Affiliation | 1.School of Microelectronics, Southern University of Science and Technology, Shenzhen, China 2.Department of Electrical and Computer Engineering, University of California, Santa Cruz, Santa Cruz, USA |
| First Author Affilication | SUSTech Institute of Microelectronics |
| First Author's First Affilication | SUSTech Institute of Microelectronics |
| Recommended Citation GB/T 7714 |
Dong Liu,Xinyi Wu,Lu Cheng,et al. Pressureless In-air Sintered Silver Bonding Bare Silicon Die on Silver-metallized Heat Spreader[C],2022:1-4.
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| Files in This Item: | There are no files associated with this item. | |||||
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