中文版 | English
Title

Pressureless In-air Sintered Silver Bonding Bare Silicon Die on Silver-metallized Heat Spreader

Author
DOI
Publication Years
2022
ISBN
978-1-6654-9906-4
Source Title
Pages
1-4
Conference Date
10-13 Aug. 2022
Conference Place
Dalian, China
Keywords
SUSTech Authorship
First
URL[Source Record]
Data Source
IEEE
PDF urlhttps://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9872695
Citation statistics
Cited Times [WOS]:0
Document TypeConference paper
Identifierhttp://kc.sustech.edu.cn/handle/2SGJ60CL/401516
DepartmentSUSTech Institute of Microelectronics
Affiliation
1.School of Microelectronics, Southern University of Science and Technology, Shenzhen, China
2.Department of Electrical and Computer Engineering, University of California, Santa Cruz, Santa Cruz, USA
First Author AffilicationSUSTech Institute of Microelectronics
First Author's First AffilicationSUSTech Institute of Microelectronics
Recommended Citation
GB/T 7714
Dong Liu,Xinyi Wu,Lu Cheng,et al. Pressureless In-air Sintered Silver Bonding Bare Silicon Die on Silver-metallized Heat Spreader[C],2022:1-4.
Files in This Item:
There are no files associated with this item.
Related Services
Fulltext link
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Export to Excel
Export to Csv
Altmetrics Score
Google Scholar
Similar articles in Google Scholar
[Dong Liu]'s Articles
[Xinyi Wu]'s Articles
[Lu Cheng]'s Articles
Baidu Scholar
Similar articles in Baidu Scholar
[Dong Liu]'s Articles
[Xinyi Wu]'s Articles
[Lu Cheng]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Dong Liu]'s Articles
[Xinyi Wu]'s Articles
[Lu Cheng]'s Articles
Terms of Use
No data!
Social Bookmark/Share
No comment.

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.