| Title | Research on Thermal-Mechanical Properties of GaN Power Module Based on QFN Package by Using Nano Copper/Silver Sinter Paste |
| Author | |
| DOI | |
| Publication Years | 2022
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| ISBN | 978-1-6654-9906-4
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| Source Title | |
| Pages | 1-7
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| Conference Date | 10-13 Aug. 2022
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| Conference Place | Dalian, China
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| Keywords | |
| SUSTech Authorship | First
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| URL | [Source Record] |
| Data Source | IEEE
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| PDF url | https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9873399 |
| Citation statistics |
Cited Times [WOS]:0
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| Document Type | Conference paper |
| Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/401534 |
| Department | SUSTech Institute of Microelectronics |
| Affiliation | 1.School of Microelectronics, Southern University of Science and Technology, Shenzhen, China 2.Electrical Engineering, Mathematics and Computer Science, Delft University of Technology, Delft, The Netherlands 3.Academy for Engineering&Technology, Fudan University, Shanghai, China 4.Hong Kong Applied Science and Technology Research Institute, Hong Kong, China 5.Southern University of Science and Technology, Shenzhen, China |
| First Author Affilication | SUSTech Institute of Microelectronics |
| First Author's First Affilication | SUSTech Institute of Microelectronics |
| Recommended Citation GB/T 7714 |
Shizhen Li,Xu Liu,Jiajie Fan,et al. Research on Thermal-Mechanical Properties of GaN Power Module Based on QFN Package by Using Nano Copper/Silver Sinter Paste[C],2022:1-7.
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| Files in This Item: | There are no files associated with this item. | |||||
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