| Title | Fracture Toughness Characterization of Thin Films Based on Finite Element Assisted Nanoindentation Technique |
| Author | |
| DOI | |
| Publication Years | 2022
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| ISBN | 978-1-6654-9906-4
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| Source Title | |
| Pages | 1-5
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| Conference Date | 10-13 Aug. 2022
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| Conference Place | Dalian, China
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| Keywords | |
| SUSTech Authorship | First
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| URL | [Source Record] |
| Data Source | IEEE
|
| PDF url | https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9873209 |
| Citation statistics |
Cited Times [WOS]:0
|
| Document Type | Conference paper |
| Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/401540 |
| Department | School of System Design and Intelligent Manufacturing |
| Affiliation | 1.School of System Design and Intelligent Manufacturing, Southern University of Science and Technology, Shenzhen, China 2.Center for Engineering Materials and Reliability, Guangzhou HKUST Fok Ying Tung Research Institute, Guangzhou, China 3.Monolithic Power System, Chengdu, China |
| First Author Affilication | School of System Design and Intelligent Manufacturing |
| First Author's First Affilication | School of System Design and Intelligent Manufacturing |
| Recommended Citation GB/T 7714 |
Weiquan Luo,Weijing Dai,Cheng Chen,et al. Fracture Toughness Characterization of Thin Films Based on Finite Element Assisted Nanoindentation Technique[C],2022:1-5.
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| Files in This Item: | There are no files associated with this item. | |||||
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