中文版 | English
Title

Research on mechanical reliability of multilayer packaging substrate based on build-up film

Author
DOI
Publication Years
2022
ISBN
978-1-6654-9906-4
Source Title
Pages
1-5
Conference Date
10-13 Aug. 2022
Conference Place
Dalian, China
Keywords
SUSTech Authorship
First
URL[Source Record]
Data Source
IEEE
PDF urlhttps://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9873161
Citation statistics
Cited Times [WOS]:0
Document TypeConference paper
Identifierhttp://kc.sustech.edu.cn/handle/2SGJ60CL/401541
DepartmentInstitute of Advanced Technology
Affiliation
1.Shenzhen Institute of Advanced Technology, Chinese Academy of Science, Southern University of Science and Technology, Shenzhen, China
2.Shenzhen Institute of Advanced Technology, Chinese Academy of Science Shenzhen Institute of Advanced Electronic Materials, Shenzhen, China
First Author AffilicationInstitute of Advanced Technology
First Author's First AffilicationInstitute of Advanced Technology
Recommended Citation
GB/T 7714
Wenbo Chen,Cheng Zhong,Junyi Yu,et al. Research on mechanical reliability of multilayer packaging substrate based on build-up film[C],2022:1-5.
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