| Title | Research on mechanical reliability of multilayer packaging substrate based on build-up film |
| Author | |
| DOI | |
| Publication Years | 2022
|
| ISBN | 978-1-6654-9906-4
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| Source Title | |
| Pages | 1-5
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| Conference Date | 10-13 Aug. 2022
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| Conference Place | Dalian, China
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| Keywords | |
| SUSTech Authorship | First
|
| URL | [Source Record] |
| Data Source | IEEE
|
| PDF url | https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9873161 |
| Citation statistics |
Cited Times [WOS]:0
|
| Document Type | Conference paper |
| Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/401541 |
| Department | Institute of Advanced Technology |
| Affiliation | 1.Shenzhen Institute of Advanced Technology, Chinese Academy of Science, Southern University of Science and Technology, Shenzhen, China 2.Shenzhen Institute of Advanced Technology, Chinese Academy of Science Shenzhen Institute of Advanced Electronic Materials, Shenzhen, China |
| First Author Affilication | Institute of Advanced Technology |
| First Author's First Affilication | Institute of Advanced Technology |
| Recommended Citation GB/T 7714 |
Wenbo Chen,Cheng Zhong,Junyi Yu,et al. Research on mechanical reliability of multilayer packaging substrate based on build-up film[C],2022:1-5.
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| Files in This Item: | There are no files associated with this item. | |||||
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