| Title | Nanotwinned copper electroplating with halide engineered grain morphologies |
| Author | |
| DOI | |
| Publication Years | 2022
|
| ISBN | 978-1-6654-9906-4
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| Source Title | |
| Pages | 1-5
|
| Conference Date | 10-13 Aug. 2022
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| Conference Place | Dalian, China
|
| Keywords | |
| SUSTech Authorship | Others
|
| URL | [Source Record] |
| Data Source | IEEE
|
| PDF url | https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9873345 |
| Citation statistics |
Cited Times [WOS]:0
|
| Document Type | Conference paper |
| Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/401553 |
| Department | College of Engineering |
| Affiliation | 1.College of Materials Science and Engineering, Shenzhen University, Shenzhen, China 2.College of Engineering, Southern University of Science and Technology, Shenzhen, China 3.Shenzhen Institute of Advanced Technology, CAS, Shenzhen Institute of Advanced Electronic Materials, Shenzhen, China |
| Recommended Citation GB/T 7714 |
Zhen-Jia Peng,Yi Dong,Zhe Li,et al. Nanotwinned copper electroplating with halide engineered grain morphologies[C],2022:1-5.
|
| Files in This Item: | There are no files associated with this item. | |||||
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