| Title | AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics |
| Author | |
| Corresponding Author | Xia, Jianfei; Li, Baowen; Sun, Bin |
| Publication Years | 2022-09-01
|
| DOI | |
| Source Title | |
| ISSN | 1944-8244
|
| EISSN | 1944-8252
|
| Abstract | Thermal management of flexible/stretchable electronics has been a crucial issue. Mass supernumerary thermal heat is created in the repetitive course of deformation because of the large nanocontact resistance between electric conductive fillers, as well as the interfacial resistance between fillers and the polymer matrix. Here, we report a stretchable thermoplastic polyurethane (TPU)-boron nitride nanosheet (BNNS) composite film with a high in-plane thermal conductivity based on an air/water interfacial (AWI) assembly method. In addition to rigid devices, it was capable for thermal management of flexible electronics. During more than 2000 cycles of the bending-releasing process, the average saturated surface temperature of the flexible conductor covered with composite film with 30 wt % BNNSs was approximately 40.8 +/- 1 degrees C (10.5 degrees C lower than that with pure TPU). Moreover, the thermal dissipating property of the composite under stretching was measured. All the results prove that this TPUBNNS composite film is a candidate for thermal management of next-generation flexible/stretchable electronics with high power density. |
| Keywords | |
| URL | [Source Record] |
| Indexed By | |
| Language | English
|
| SUSTech Authorship | Corresponding
|
| Funding Project | Natural Science Foundation of Shandong Province[ZR2020ME193]
; Shandong Natural Science Funds for Distinguished Young Scholar[ZR2020JQ20]
|
| WOS Research Area | Science & Technology - Other Topics
; Materials Science
|
| WOS Subject | Nanoscience & Nanotechnology
; Materials Science, Multidisciplinary
|
| WOS Accession No | WOS:000851037900001
|
| Publisher | |
| Data Source | Web of Science
|
| Citation statistics |
Cited Times [WOS]:0
|
| Document Type | Journal Article |
| Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/401574 |
| Department | Department of Physics 量子科学与工程研究院 工学院_材料科学与工程系 |
| Affiliation | 1.Qingdao Univ, Coll Phys, Qingdao 266071, Peoples R China 2.Qingdao Univ, Coll Elect & Informat, Qingdao 266071, Peoples R China 3.Maanshan Univ, Dept Basic, Maanshan 243100, Peoples R China 4.Southern Univ Sci & Technol, Shenzhen Inst Quantum Sci & Engn, Dept Mat Sci & Engn, Dept Phys, R China, Shenzhen 518055, Peoples R China 5.Qingdao Univ, Instrumental Anal Ctr, Coll Chem & Chem Engn, Shandong Sino Japanese Ctr Collaborat Res Carbon N, Qingdao 266071, Peoples R China 6.Qingdao Univ, Weihai Innovat Res Inst, Weihai 264200, Peoples R China 7.Univ Colorado, Paul M Rady Dept Mech Engn, Boulder, CO 80305 USA 8.Univ Colorado, Dept Phys, Boulder, CO 80305 USA |
| Corresponding Author Affilication | Department of Physics; Institute for Quantum Science and Engineering; Department of Materials Science and Engineering |
| Recommended Citation GB/T 7714 |
Wang, Qiaoli,Li, Tianshuo,Ding, Yafei,et al. AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics[J]. ACS Applied Materials & Interfaces,2022.
|
| APA |
Wang, Qiaoli.,Li, Tianshuo.,Ding, Yafei.,Chen, Huibao.,Cao, Xiyue.,...&Sun, Bin.(2022).AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics.ACS Applied Materials & Interfaces.
|
| MLA |
Wang, Qiaoli,et al."AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics".ACS Applied Materials & Interfaces (2022).
|
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