TEMT: A Transient Electronic-Magnetic-Thermal Coupled Simulation Framework for STT-MTJs

Liu，Dawei; Chen，Quan

2022

10.1109/TCAD.2022.3204233

IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS   Impact Factor & Quartile

0278-0070

1937-4151

Being a promising candidate for future non-volatile memory and neuromorphic computing, Spin-Transfer-Torque Magnetic Tunnel Junction (STT-MTJ) devices are gaining substantial momentum in industrial adoption in recent years, calling for EDA support for higher modeling capabilities. However, the complex interplay of multiple physical mechanisms featured in MTJ devices impose substantial challenges to their numerical modeling. In this work, we propose a fully coupled, transient electronic-magnetic-thermal (TEMT) modelling approach for STT-MTJ devices. Aiming to be first-principle and physically holistic, TEMT combines the atomistic non-equilibrium Green’s function (NEGF) model for tunneling currents, the Landau-Lifshitz-Gilbert-Slonczewski (LLGS) equation for magnetic dynamics and the heat conduction equation (HCE) for thermal dynamics in a self-consistent manner. To alleviate computational burden, we also devise an analytical approximation approach to reduce the number of NEGF solutions in the TEMT framework, which leads to over 15X speed-up with a very mild accuracy loss. An in-depth investigation of STT-MTJ devices using the TEMT framework is conducted to demonstrate its benefits and performance.

analytical approximation electronic-magnetic-thermal coupling Frequency modulation Integrated circuit modeling Magnetic anisotropy Magnetic tunneling Magnetization Mathematical models multi-physics Numerical models STT-MTJ transient simulation

EI

English

First

20223812754984

Circuit simulation ; Digital storage ; Frequency modulation ; Heat conduction ; Magnetic anisotropy ; Magnetic devices ; Timing circuits ; Tunnel junctions

Heat Transfer:641.2 ; Magnetism: Basic Concepts and Phenomena:701.2 ; Electric Network Analysis:703.1.1 ; Pulse Circuits:713.4 ; Data Storage, Equipment and Techniques:722.1 ; Mathematics:921 ; Physical Properties of Gases, Liquids and Solids:931.2

ENGINEERING

2-s2.0-85137887939

Scopus

School of Microelectronics, Southern University of Science and Technology, Shenzhen, China

Liu，Dawei,Chen，Quan. TEMT: A Transient Electronic-Magnetic-Thermal Coupled Simulation Framework for STT-MTJs[J]. IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS,2022,PP(99):1-1.

Liu，Dawei,&Chen，Quan.(2022).TEMT: A Transient Electronic-Magnetic-Thermal Coupled Simulation Framework for STT-MTJs.IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS,PP(99),1-1.

Liu，Dawei,et al."TEMT: A Transient Electronic-Magnetic-Thermal Coupled Simulation Framework for STT-MTJs".IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS PP.99(2022):1-1.