| Title | Research on Micro-LEDs Flip Chip Interconnection Technology |
| Author | |
| DOI | |
| Publication Years | 2022
|
| ISSN | 0097-966X
|
| EISSN | 2168-0159
|
| Source Title | |
| Volume | 53
|
| Issue | S1
|
| Pages | 892-894
|
| Abstract | The pixel unit of Micro-LEDs is below 100 μm (P0.1) and is integrated on a chip with high density. The miniaturized Micro-LEDs has higher luminous brightness, resolution and color saturation, as well as faster display response speed. Micro-LEDs is expected to be applied to augmented reality (AR) miniature projection devices and car head-ups that require higher brightness, super large display billboards and other special display application products. |
| Keywords | |
| SUSTech Authorship | First
|
| Language | English
|
| URL | [Source Record] |
| Scopus EID | 2-s2.0-85141897182
|
| Data Source | Scopus
|
| Citation statistics |
Cited Times [WOS]:0
|
| Document Type | Conference paper |
| Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/411856 |
| Department | Department of Electrical and Electronic Engineering |
| Affiliation | Dept. of Electrical and Electronic Engineering,Southern University of Science and Technology,Shenzhen,Guangdong,China |
| First Author Affilication | Department of Electrical and Electronic Engineering |
| First Author's First Affilication | Department of Electrical and Electronic Engineering |
| Recommended Citation GB/T 7714 |
Xie，Shifeng,Wang，Hao,Liu，Zhaojun. Research on Micro-LEDs Flip Chip Interconnection Technology[C],2022:892-894.
|
| Files in This Item: | There are no files associated with this item. | |||||
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