Fabrication of ultrahigh-resolution Micro-LED display by flip-chip bonding
Micro-LEDs are considered as one of the most promising candidates for next-generation display application, because Micro-LEDs have advantages in high resolution, high luminous efficiency, brightness, and long operating lifetime. These features make them the most promising platform in high-end display applications, especially for AR/VR displays which requires a 1500ppi because of the human natural eye resolution acuity of about 60 pixels per degree. In this work, we have fabricated ultrahigh resolution (5000 PPI) Micro-LED displays utilizing flip-chip bonding technique to obtain exquisite results.
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|Document Type||Conference paper|
|Department||Department of Electrical and Electronic Engineering|
Department of Electrical and Electronic Engineering,Southern University of Science and Technology,Shenzhen,Guangdong,China
|First Author Affilication||Department of Electrical and Electronic Engineering|
|Corresponding Author Affilication||Department of Electrical and Electronic Engineering|
|First Author's First Affilication||Department of Electrical and Electronic Engineering|
Wenjun，Huang,Yonghong，Lin,Zhaojun，Liu. Fabrication of ultrahigh-resolution Micro-LED display by flip-chip bonding[C],2022:877-878.
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