| Title | Fabrication of ultrahigh-resolution Micro-LED display by flip-chip bonding |
| Author | |
| Corresponding Author | Zhaojun，Liu |
| DOI | |
| Publication Years | 2022
|
| ISSN | 0097-966X
|
| EISSN | 2168-0159
|
| Source Title | |
| Volume | 53
|
| Issue | S1
|
| Pages | 877-878
|
| Abstract | Micro-LEDs are considered as one of the most promising candidates for next-generation display application, because Micro-LEDs have advantages in high resolution, high luminous efficiency, brightness, and long operating lifetime. These features make them the most promising platform in high-end display applications, especially for AR/VR displays which requires a 1500ppi because of the human natural eye resolution acuity of about 60 pixels per degree. In this work, we have fabricated ultrahigh resolution (5000 PPI) Micro-LED displays utilizing flip-chip bonding technique to obtain exquisite results. |
| Keywords | |
| SUSTech Authorship | First
; Corresponding
|
| Language | English
|
| URL | [Source Record] |
| Scopus EID | 2-s2.0-85141895521
|
| Data Source | Scopus
|
| Citation statistics |
Cited Times [WOS]:0
|
| Document Type | Conference paper |
| Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/411858 |
| Department | Department of Electrical and Electronic Engineering |
| Affiliation | Department of Electrical and Electronic Engineering,Southern University of Science and Technology,Shenzhen,Guangdong,China |
| First Author Affilication | Department of Electrical and Electronic Engineering |
| Corresponding Author Affilication | Department of Electrical and Electronic Engineering |
| First Author's First Affilication | Department of Electrical and Electronic Engineering |
| Recommended Citation GB/T 7714 |
Wenjun，Huang,Yonghong，Lin,Zhaojun，Liu. Fabrication of ultrahigh-resolution Micro-LED display by flip-chip bonding[C],2022:877-878.
|
| Files in This Item: | There are no files associated with this item. | |||||
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