Title | Homogenization of microstructure and mechanical properties of wire arc additive manufactured martensitic stainless steel through optimization of post-process heat treatment |
Author | |
Corresponding Author | Sato, Yutaka S. |
Publication Years | 2022-12-01
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DOI | |
Source Title | |
ISSN | 2238-7854
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EISSN | 2214-0697
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Volume | 21 |
Abstract | A single-bead multilayer martensitic stainless steel thin wall was fabricated using the wire arc additive manufacturing (WAAM) process. After the WAAM process, the tempering heat treatment was carried out to homogenize the microstructure distribution in the wire arc additive manu-factured (WAAMed) part. To optimize the tempering temperature, the as-WAAMed samples were subjected to varying tempering temperatures of 300, 500, 600, and 700 degrees C for 2 h. The heteroge-neous structure within the as-WAAMed part was hardly eliminated by the low tempering tem-peratures of 300 and 500 degrees C. On the other hand, the inhomogeneous hardness profiles were significantly homogenized by the tempering temperature of 600 and 700 degrees C. Tempering at 600 degrees C removed the heterogeneous structure, resulting in the effective homogenization of the signifi-cantly heterogeneous hardness profile and microstructure distribution in the as-WAAMed part. Tempering at 700 degrees C led to the lower hardness than that at 600 degrees C.The anisotropic tensile prop-erties of the as-WAAMed part were also eliminated after tempering at 600 degrees C. The significant differences in the toughness of the different layers of the as-WAAMed part were effectively reduced by proper tempering. The slight decrease in toughness of the post-process heat-treated sample from the bottom to the top of the thin wall was mainly caused by the increase in the martensitic block size inherited from the prior austenite grain structure. This study suggests that tempering at 600 degrees C for 2 h is an effective post-process heat treatment to homogenize the microstructure and mechanical properties of as-WAAMed 2Cr13 martensitic stainless steel.(c) 2022 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/). |
Keywords | |
URL | [Source Record] |
Indexed By | |
Language | English
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SUSTech Authorship | Others
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WOS Research Area | Materials Science
; Metallurgy & Metallurgical Engineering
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WOS Subject | Materials Science, Multidisciplinary
; Metallurgy & Metallurgical Engineering
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WOS Accession No | WOS:000883064900006
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Publisher | |
Data Source | Web of Science
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Citation statistics |
Cited Times [WOS]:0
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Document Type | Journal Article |
Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/412188 |
Department | Department of Mechanical and Energy Engineering |
Affiliation | 1.Tohoku Univ, Grad Sch Engn, Dept Mat Proc, 6-6-02 Aramaki Aza Aoba, Sendai, Miyagi 9808579, Japan 2.Southern Univ Sci & Technol, Dept Mech & Energy Engn, Shenzhen, Peoples R China 3.Shenzhen Key Lab Addit Mfg High Performance Mat, Shenzhen 518055, Peoples R China 4.Tsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China |
First Author Affilication | Department of Mechanical and Energy Engineering |
Recommended Citation GB/T 7714 |
Lyu, Zhiwei,Sato, Yutaka S.,Tokita, Shun,et al. Homogenization of microstructure and mechanical properties of wire arc additive manufactured martensitic stainless steel through optimization of post-process heat treatment[J]. Journal of Materials Research and Technology-JMR&T,2022,21.
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APA |
Lyu, Zhiwei,Sato, Yutaka S.,Tokita, Shun,Zhao, Yue,Jia, Jinlong,&Wu, Aiping.(2022).Homogenization of microstructure and mechanical properties of wire arc additive manufactured martensitic stainless steel through optimization of post-process heat treatment.Journal of Materials Research and Technology-JMR&T,21.
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MLA |
Lyu, Zhiwei,et al."Homogenization of microstructure and mechanical properties of wire arc additive manufactured martensitic stainless steel through optimization of post-process heat treatment".Journal of Materials Research and Technology-JMR&T 21(2022).
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