Indentation of pre-deformed compressible soft electroactive layer on substrate

Xia, Guozhan1,2,3,4; Hong, Wei1; Chen, Weiqiu2,3,4,5,6

2023-01-15

10.1016/j.ijmecsci.2022.107834

INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES   Impact Factor & Quartile

0020-7403

1879-2162

Layer-substrate system penetrated by a rigid indenter has been frequently used as the physical model for interpreting the indentation test of advanced materials. In this paper, the indentation of a pre-deformed compressible soft electroactive (SEA) layer on an elastic substrate is formulated as a Fredholm integral equa-tion of the second kind, which is solved by a customized finite-difference scheme to fulfil the full-field analysis. Especially, the modified JKR model established in the half-space case is invoked to take account of surface adhesion for the peculiar layer-substrate system. As an example, the neo-Hookean ideal dielectric elastomer is considered, and the effects of adhesion (due to surface energy) and substrate (due to different mechanical and electrical properties from the layer) on the indentation responses are scrutinized. Numerical results indicate that, when a soft layer overlies a stiffer substrate, the contact radius should be smaller than the layer thickness for the validity of linear analysis. In this case, as the contact radius exceeds about 1/10 of the layer thickness, the indentation responses are found to vary significantly with the shear modulus ratio between the layer and the substrate while they are insensitive to the variation of Poisson's ratio of the substrate within the linear regime. Moreover, an interesting phenomenon is revealed that the indentation responses (e.g., the surface normal stress) induced by adhesion will be suppressed by stiffening of the substrate, and vice versa.

Indentation Soft electroactive layer Surface adhesion Substrate effect Interface condition

SCI

English

First ; Corresponding

National Natural Science Foundation of China["12192210,12192211","12202171"] ; 111 Project[B21034] ; Shenzhen Scientific and Tech-nological Fund for RD, PR China[2021Szvup152] ; Shenzhen Science, Technology and Innovation Commission[ZDSYS20210623092005017]

Engineering ; Mechanics

Engineering, Mechanical ; Mechanics

WOS:000896600500005

PERGAMON-ELSEVIER SCIENCE LTD

ENGINEERING

Web of Science

1.Southern Univ Sci & Technol, Dept Mech & Aerosp Engn, Shenzhen Key Lab Soft Mech & Smart Mfg, Shenzhen 518055, Peoples R China
2.Zhejiang Univ, Key Lab Soft Machines & Smart Devices Zhejiang Pro, Hangzhou 310027, Peoples R China
3.Zhejiang Univ, Dept Engn Mech, Hangzhou 310027, Peoples R China
4.Zhejiang Univ, Soft Matter Res Ctr, Hangzhou 310027, Peoples R China
5.Zhejiang Univ, State Key Lab CAD & CG, Hangzhou 310058, Peoples R China
6.Zhejiang Univ, Shenzhen Res Inst, Shenzhen 518057, Peoples R China

Xia, Guozhan,Hong, Wei,Chen, Weiqiu. Indentation of pre-deformed compressible soft electroactive layer on substrate[J]. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES,2023,238.

Xia, Guozhan,Hong, Wei,&Chen, Weiqiu.(2023).Indentation of pre-deformed compressible soft electroactive layer on substrate.INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES,238.

Xia, Guozhan,et al."Indentation of pre-deformed compressible soft electroactive layer on substrate".INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES 238(2023).