| Title | Tensor Voting Based Similarity Matching of Wafer Bin Maps in Semiconductor Manufacturing |
| Author | |
| DOI | |
| Publication Years | 2022
|
| Conference Name | 2022 5th International Conference on Data Science and Information Technology (DSIT)
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| ISBN | 978-1-6654-9869-2
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| Source Title | |
| Pages | 1-6
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| Conference Date | 22-24 July 2022
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| Conference Place | Shanghai, China
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| Keywords | |
| SUSTech Authorship | Others
|
| Language | English
|
| URL | [Source Record] |
| Data Source | IEEE
|
| PDF url | https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9943882 |
| Citation statistics |
Cited Times [WOS]:0
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| Document Type | Conference paper |
| Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/415461 |
| Department | Department of Information Systems and Management Engineering |
| Affiliation | 1.School of Mechanical Engineering and Automation, Harbin Institute of Technology, Shenzhen, China 2.Department of Information Systems and Management Engineering, Southern University of Science and Technology, Shenzhen, China |
| Recommended Citation GB/T 7714 |
Rui Wang,Songhao Wang. Tensor Voting Based Similarity Matching of Wafer Bin Maps in Semiconductor Manufacturing[C],2022:1-6.
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| Files in This Item: | There are no files associated with this item. | |||||
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