Title | Is the hardness of material harder than diamond reliable? |
Author | |
Corresponding Author | Zhan, Guodong David; He, Duanwei; Wang, Liping |
Publication Years | 2023-05-01
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DOI | |
Source Title | |
ISSN | 1005-0302
|
EISSN | 1941-1162
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Volume | 144Pages:111-117 |
Abstract | With the development of new synthesis methods and chemistries, a number of new superhard materials have been reported to be harder than diamond. While such materials are highly desirable due to their wide-ranging applications, there are some inherent uncertainties in the methods utilized to determine and define the hardness of such materials. In this paper, we employed the standard Vickers diamond indenter and substitute indenters with the same shape to measure the hardness of nine ceramics and superhard materials within well-defined criteria and methodology, for the assessment of consistency in the hardness testing. The findings and the developed testing method in the current study have broad implications in characterizing new and emerging superhard materials, leading to new discoveries.(c) 2022 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology. |
Keywords | |
URL | [Source Record] |
Indexed By | |
Language | English
|
SUSTech Authorship | Corresponding
|
Funding Project | National Key R&D Program of China[2018YFA0305900]
; National Natural Science Foundation of China["11872198","U2030110","51472171","11427810","11704014"]
; Science and Technology Innovation Team of Sichuan Province[15CXTD0025]
; Key Research Projects of Jingchu University of Technology["HX202160","HX2022001"]
; Saudi Aramco[4600000955]
; Chengdu Dongwei Technology Co. Ltd[4600000955]
; Shenzhen Science and Technology Program["JCYJ20190813103201662","JCYJ20210324121405014"]
; Key Research Platforms and Research Projects of Universities in Guangdong Province[2020ZDZX2035]
; Natural Science Foundation of Top Talent of Shenzhen Technology University (SZTU)[2019202]
; Shenzhen Peacock Plan[KQTD2016053019134356]
; Guangdong Innovative & Entrepreneurial Research Team Program[2016ZT06C279]
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WOS Research Area | Materials Science
; Metallurgy & Metallurgical Engineering
|
WOS Subject | Materials Science, Multidisciplinary
; Metallurgy & Metallurgical Engineering
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WOS Accession No | WOS:000913368100004
|
Publisher | |
ESI Research Field | MATERIALS SCIENCE
|
Scopus EID | 2-s2.0-85143853262
|
Data Source | Web of Science
|
Citation statistics |
Cited Times [WOS]:1
|
Document Type | Journal Article |
Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/425162 |
Department | Academy for Advanced Interdisciplinary Studies 理学院_物理系 |
Affiliation | 1.Sichuan Univ, Inst Atom & Mol Phys, Chengdu 610065, Peoples R China 2.Jingchu Univ Technol, Sch Mech Engn, Jingmen 448000, Peoples R China 3.Southern Univ Sci & Technol, Acad Adv Interdisciplinary Studies, Shenzhen 518055, Peoples R China 4.Southern Univ Sci & Technol, Dept Phys, Shenzhen 518055, Peoples R China 5.Shenzhen Technol Univ, Coll Engn Phys, Shenzhen Key Lab Ultraintense Laser & Adv Mat Tech, Shenzhen 518118, Peoples R China 6.Shenzhen Technol Univ, Ctr Adv Mat Diagnost Technol, Shenzhen 518118, Peoples R China 7.Saudi Aramco, Drilling Technol Div, Dhahran 31311, Saudi Arabia 8.Saudi Aramco, Explorat & Petr Engn Ctr, Adv Res Ctr EXPEC ARC, Dhahran 31311, Saudi Arabia |
First Author Affilication | Academy for Advanced Interdisciplinary Studies; Department of Physics |
Corresponding Author Affilication | Academy for Advanced Interdisciplinary Studies; Department of Physics |
Recommended Citation GB/T 7714 |
Liu, Jin,Zou, Yongtao,Zhan, Guodong David,et al. Is the hardness of material harder than diamond reliable?[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2023,144:111-117.
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APA |
Liu, Jin.,Zou, Yongtao.,Zhan, Guodong David.,Wang, Pei.,Yan, Xiaozhi.,...&Wang, Liping.(2023).Is the hardness of material harder than diamond reliable?.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,144,111-117.
|
MLA |
Liu, Jin,et al."Is the hardness of material harder than diamond reliable?".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 144(2023):111-117.
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