Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip

Sattari, Romina1; Hu, Dong1; Liu, Xu1,2; van Zeijl, Henk1; Vollebregt, Sten1; Zhang, Guoqi1

2023-02-25

10.1016/j.applthermaleng.2022.119503

APPLIED THERMAL ENGINEERING   Impact Factor & Quartile

1359-4311

1873-5606

The rapid development of power electronics has challenged the thermal integrity of semiconductor packaging. Further developments in this domain can be supported significantly by utilizing fast and flexible thermal characteristic evaluation. This study employs the transient dual interface method (TDIM) to characterize and compare the thermal resistance of Ag-and Cu-sintered die-attach joints using an in-house developed thermal test chip (TTC). The proposed TTC with 82.5% active area achieves a temperature sensitivity of 12 omega/K and maximum power of 360 W per cell, which are 50% and 44% higher than the state-of-the-art, respectively. The uniformity of the temperature distribution (1 degrees C at 68 W) is verified by infrared thermography. The cost-effective manufacturing process allows the design to be applied to any substrate, such as SiC or GaN. Ag and Cu sintering is performed to bond the TTC on a Cu substrate, and the junction-to-case thermal resistance of the sintered structures is extracted. The lowest junction-to-case thermal resistance of 0.144 K/W is measured for the device sintered using Ag paste. Meanwhile, the Cu sintered structure exhibits a comparable value of 0.158 K/W. The proposed TTC in combination with TDIM accelerates the introduction of novel and cost-effective materials such as Cu.

Power electronics Sintered die-attach joints Transient dual interface method Thermal test chip Junction-to-case thermal resistance Infrared thermography

SCI

English

Others

ECSEL Joint Undertaking (JU)[826417] ; National Key R&D Program of China[2018YFE0204600] ; JU[17006]

Thermodynamics ; Energy & Fuels ; Engineering ; Mechanics

Thermodynamics ; Energy & Fuels ; Engineering, Mechanical ; Mechanics

WOS:000912891500001

PERGAMON-ELSEVIER SCIENCE LTD

ENGINEERING

2-s2.0-85144894567

Web of Science

1.Delft Univ Technol, Dept Microelect, NL-2628 CD Delft, Netherlands
2.Southern Univ Sci & Technol, Sch Microelect, Shenzhen 518055, Peoples R China

Sattari, Romina,Hu, Dong,Liu, Xu,et al. Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip[J]. APPLIED THERMAL ENGINEERING,2023,221.

Sattari, Romina,Hu, Dong,Liu, Xu,van Zeijl, Henk,Vollebregt, Sten,&Zhang, Guoqi.(2023).Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip.APPLIED THERMAL ENGINEERING,221.

Sattari, Romina,et al."Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip".APPLIED THERMAL ENGINEERING 221(2023).