中文版 | English
Title

Microstructures, thermal and mechanical properties of Al–Si-CNT composites for thermal management applications

Author
Corresponding AuthorYe,Shulong
Publication Years
2023-03-01
DOI
Source Title
ISSN
0254-0584
Volume297
Abstract
In this work, a novel electronic packaging material, Al–Si-CNT composite, is fabricated by ball milling and hot extrusion of Al20Si powder blended with different amount of carbon nanotubes (CNTs). The influences of CNTs content on the microstructures, thermal properties and mechanical properties of the composites are investigated. The ball milling produces flake powders in which CNTs, accompanied by refined Si particles and in-situ formed k'-AlO, are uniformly dispersed in the Al matrix. The homogenous microstructures are subsequently inherited by the extruded composites. Compared to the Al20Si sample without CNT addition, the CNT-contained composites are more thermally stable and resistant to structural coarsening caused by Ostwald ripening effect. The composite with 2 wt % CNT content exhibits the best properties among all samples. It has a high tensile yield strength ∼235 MPa, and low thermal expansion coefficient ∼16.8 × 10 K (at 50–400 °C) as well as acceptable thermal conductivity ∼102 WmK (at 50–400 °C). This study using hybrid reinforcements Si and CNTs to enhance the Al matrix composite is inspiring to design high performance thermal management materials.
Keywords
URL[Source Record]
Language
English
SUSTech Authorship
Others
ESI Research Field
MATERIALS SCIENCE
Scopus EID
2-s2.0-85146274733
Data Source
Scopus
Citation statistics
Cited Times [WOS]:0
Document TypeJournal Article
Identifierhttp://kc.sustech.edu.cn/handle/2SGJ60CL/442639
DepartmentDepartment of Materials Science and Engineering
Affiliation
1.Faculty of Materials Science,Shenzhen MSU-BIT University,Shenzhen,518172,China
2.Department of Materials Science and Engineering,Southern University of Science and Technology,Shenzhen,518055,China
3.Department of Materials Science and Engineering,Northwestern University,Evanston,60208,United States
4.Shenzhen ElementPlus Material Technology Co. Ltd.,Shenzhen,518107,China
First Author AffilicationDepartment of Materials Science and Engineering
Recommended Citation
GB/T 7714
Ding,Chao,Lu,Zhouguang,Li,Shukui,等. Microstructures, thermal and mechanical properties of Al–Si-CNT composites for thermal management applications[J]. MATERIALS CHEMISTRY AND PHYSICS,2023,297.
APA
Ding,Chao,Lu,Zhouguang,Li,Shukui,Wang,Ziming,Yu,Peng,&Ye,Shulong.(2023).Microstructures, thermal and mechanical properties of Al–Si-CNT composites for thermal management applications.MATERIALS CHEMISTRY AND PHYSICS,297.
MLA
Ding,Chao,et al."Microstructures, thermal and mechanical properties of Al–Si-CNT composites for thermal management applications".MATERIALS CHEMISTRY AND PHYSICS 297(2023).
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