| Title | 一种倒装芯片贴合装置 |
| Author | |
| First Inventor | 张立源
|
| Original applicant | 南方科技大学
|
| Application Number | 202121778332.4
|
| Application Date | 2021-08-02
|
| Publication Years | 2022-01-07
|
| Patent Number | 202121778332.4
|
| Status of Patent | 授权
|
| Subtype | 实用新型
|
| SUSTech Authorship | First
|
| Language | Chinese
|
| Data Source | 人工提交
|
| Document Type | Patent |
| Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/497259 |
| Department | Department of Physics |
| Affiliation | 南方科技大学 |
| Recommended Citation GB/T 7714 |
张立源,史刚,王文,等. 一种倒装芯片贴合装置. 202121778332.4[P]. 2022-01-07.
|
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| 2.一种倒装芯片贴合装置（授权）.pdf（176KB） | Restricted Access | -- | ||||
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