中文版 | English
Title

Low-loss interconnects for modular superconducting quantum processors

Author
Corresponding AuthorLiu, Song; Zhong, Youpeng; Cleland, Andrew N.; Yu, Dapeng
Publication Years
2023-02-01
DOI
Source Title
ISSN
2520-1131
Abstract

["Low-loss superconducting aluminium cables and on-chip impedance transformers can be used to link qubit modules and create superconducting quantum computing networks with high-fidelity intermodule state transfer.","Scaling is now a key challenge in superconducting quantum computing. One solution is to build modular systems in which smaller-scale quantum modules are individually constructed and calibrated and then assembled into a larger architecture. This, however, requires the development of suitable interconnects. Here we report low-loss interconnects based on pure aluminium coaxial cables and on-chip impedance transformers featuring quality factors of up to 8.1 x 10(5), which is comparable with the performance of our transmon qubits fabricated on a single-crystal sapphire substrate. We use these interconnects to link five quantum modules with intermodule quantum state transfer and Bell state fidelities of up to 99%. To benchmark the overall performance of the processor, we create maximally entangled, multiqubit Greenberger-Horne-Zeilinger states. The generated intermodule four-qubit Greenberger-Horne-Zeilinger state exhibits 92.0% fidelity. We also entangle up to 12 qubits in a Greenberger-Horne-Zeilinger state with 55.8 +/- 1.8% fidelity, which is above the genuine multipartite entanglement threshold of 1/2."]

URL[Source Record]
Indexed By
Language
English
SUSTech Authorship
First ; Corresponding
Funding Project
Key Area Research and Development Program of Guangdong Province[2018B030326001] ; National Natural Science Foundation of China[
WOS Research Area
Engineering
WOS Subject
Engineering, Electrical & Electronic
WOS Accession No
WOS:000939105200001
Publisher
Data Source
Web of Science
Citation statistics
Cited Times [WOS]:1
Document TypeJournal Article
Identifierhttp://kc.sustech.edu.cn/handle/2SGJ60CL/501492
DepartmentInstitute for Quantum Science and Engineering
理学院_物理系
Affiliation
1.Southern Univ Sci & Technol, Shenzhen Inst Quantum Sci & Engn, Shenzhen, Peoples R China
2.Int Quantum Acad, Shenzhen, Peoples R China
3.Southern Univ Sci & Technol, Guangdong Prov Key Lab Quantum Sci & Engn, Shenzhen, Peoples R China
4.Hefei Natl Lab, Shenzhen Branch, Shenzhen, Peoples R China
5.Southern Univ Sci & Technol, Dept Phys, Shenzhen, Peoples R China
6.Univ Chicago, Pritzker Sch Mol Engn, Chicago, IL USA
7.Argonne Natl Lab, Ctr Mol Engn, Argonne, IL USA
8.Argonne Natl Lab, Mat Sci Div, Argonne, IL USA
First Author AffilicationInstitute for Quantum Science and Engineering
Corresponding Author AffilicationInstitute for Quantum Science and Engineering;  Department of Physics
First Author's First AffilicationInstitute for Quantum Science and Engineering
Recommended Citation
GB/T 7714
Niu, Jingjing,Zhang, Libo,Liu, Yang,et al. Low-loss interconnects for modular superconducting quantum processors[J]. Nature Electronics,2023.
APA
Niu, Jingjing.,Zhang, Libo.,Liu, Yang.,Qiu, Jiawei.,Huang, Wenhui.,...&Yu, Dapeng.(2023).Low-loss interconnects for modular superconducting quantum processors.Nature Electronics.
MLA
Niu, Jingjing,et al."Low-loss interconnects for modular superconducting quantum processors".Nature Electronics (2023).
Files in This Item:
File Name/Size DocType Version Access License
Jingjing_Niu_nature_(2994KB) Restricted Access--
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