Title | Low-loss interconnects for modular superconducting quantum processors |
Author | Niu, Jingjing1,2,3,4 ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() |
Corresponding Author | Liu, Song; Zhong, Youpeng; Cleland, Andrew N.; Yu, Dapeng |
Publication Years | 2023-02-01
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DOI | |
Source Title | |
ISSN | 2520-1131
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Abstract | ["Low-loss superconducting aluminium cables and on-chip impedance transformers can be used to link qubit modules and create superconducting quantum computing networks with high-fidelity intermodule state transfer.","Scaling is now a key challenge in superconducting quantum computing. One solution is to build modular systems in which smaller-scale quantum modules are individually constructed and calibrated and then assembled into a larger architecture. This, however, requires the development of suitable interconnects. Here we report low-loss interconnects based on pure aluminium coaxial cables and on-chip impedance transformers featuring quality factors of up to 8.1 x 10(5), which is comparable with the performance of our transmon qubits fabricated on a single-crystal sapphire substrate. We use these interconnects to link five quantum modules with intermodule quantum state transfer and Bell state fidelities of up to 99%. To benchmark the overall performance of the processor, we create maximally entangled, multiqubit Greenberger-Horne-Zeilinger states. The generated intermodule four-qubit Greenberger-Horne-Zeilinger state exhibits 92.0% fidelity. We also entangle up to 12 qubits in a Greenberger-Horne-Zeilinger state with 55.8 +/- 1.8% fidelity, which is above the genuine multipartite entanglement threshold of 1/2."] |
URL | [Source Record] |
Indexed By | |
Language | English
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SUSTech Authorship | First
; Corresponding
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Funding Project | Key Area Research and Development Program of Guangdong Province[2018B030326001]
; National Natural Science Foundation of China[
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WOS Research Area | Engineering
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WOS Subject | Engineering, Electrical & Electronic
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WOS Accession No | WOS:000939105200001
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Publisher | |
Data Source | Web of Science
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Citation statistics |
Cited Times [WOS]:4
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Document Type | Journal Article |
Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/501492 |
Department | Institute for Quantum Science and Engineering 理学院_物理系 |
Affiliation | 1.Southern Univ Sci & Technol, Shenzhen Inst Quantum Sci & Engn, Shenzhen, Peoples R China 2.Int Quantum Acad, Shenzhen, Peoples R China 3.Southern Univ Sci & Technol, Guangdong Prov Key Lab Quantum Sci & Engn, Shenzhen, Peoples R China 4.Hefei Natl Lab, Shenzhen Branch, Shenzhen, Peoples R China 5.Southern Univ Sci & Technol, Dept Phys, Shenzhen, Peoples R China 6.Univ Chicago, Pritzker Sch Mol Engn, Chicago, IL USA 7.Argonne Natl Lab, Ctr Mol Engn, Argonne, IL USA 8.Argonne Natl Lab, Mat Sci Div, Argonne, IL USA |
First Author Affilication | Institute for Quantum Science and Engineering |
Corresponding Author Affilication | Institute for Quantum Science and Engineering; Department of Physics |
First Author's First Affilication | Institute for Quantum Science and Engineering |
Recommended Citation GB/T 7714 |
Niu, Jingjing,Zhang, Libo,Liu, Yang,et al. Low-loss interconnects for modular superconducting quantum processors[J]. Nature Electronics,2023.
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APA |
Niu, Jingjing.,Zhang, Libo.,Liu, Yang.,Qiu, Jiawei.,Huang, Wenhui.,...&Yu, Dapeng.(2023).Low-loss interconnects for modular superconducting quantum processors.Nature Electronics.
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MLA |
Niu, Jingjing,et al."Low-loss interconnects for modular superconducting quantum processors".Nature Electronics (2023).
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Jingjing_Niu_nature_(2994KB) | Restricted Access | -- |
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