Title | Uplimit (ZT) |
Author | |
Corresponding Author | Liu, Weishu; Zhang, Wenqing |
Publication Years | 2023-02
|
DOI | |
Source Title | |
EISSN | 2542-5293
|
Volume | 31 |
Abstract | Thermoelectric materials directly convert thermal energy and electrical power, attracting wide attention. New materials and new strategies to pursue a high ZT value mark the progress of thermoelectric materials. However, the critical factors relative to a given material's uplimit (ZT)max in the dual-parameter space of temperature carrier concentration are still an open question. In this work, we theoretically show that (ZT)max has a proximately linear relationship with B* that connects the weighted mobility, lattice thermal conductivity, and the bandgap in a single parameter. We also provide insight discussion for achieving a high B* by pursuing high U*, large Eg, and low κlat, or breaking the connections among κlat versus U*, Eg versus κlat, U* versus Eg, suggesting that B* is a good primary effective merit parameter for quick screening new thermoelectric materials.
© 2023 |
Indexed By | |
Language | English
|
SUSTech Authorship | First
; Corresponding
|
Funding Project | The work was supported the National Natural Science Foundation of China ( 51872133 ), Shenzhen Key Program for Long-Term Academic Support Plan ( 20200925164021002 ), W.L. acknowledges the support from the Tencent Foundation through the XPLORER PRIZE.The authors declare the following financial interests/personal relationships which may be considered as potential competing interests: Weishu Liu reports financial support was provided by National Natural Science Foundation of China. Weishu Liu reports financial support was provided by Shenzhen Key Program for Long-Term Academic Support Plan.The work was supported the National Natural Science Foundation of China (51872133), Shenzhen Key Program for Long-Term Academic Support Plan (20200925164021002), W.L. acknowledges the support from the Tencent Foundation through the XPLORER PRIZE.
|
Publisher | |
EI Accession Number | 20230513458247
|
EI Keywords | Carrier Mobility
; Thermal Conductivity
; Thermoelectric Equipment
; Thermoelectricity
|
ESI Classification Code | Thermoelectric Energy:615.4
; Thermodynamics:641.1
; Electricity: Basic Concepts And Phenomena:701.1
; Semiconducting Materials:712.1
|
Data Source | EV Compendex
|
Citation statistics |
Cited Times [WOS]:1
|
Document Type | Journal Article |
Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/519642 |
Department | Department of Materials Science and Engineering |
Affiliation | 1.Department of Materials Science and Engineering, Southern University of Science and Technology, No.1088 Xueyuan Blvd, Shenzhen; 518055, China 2.Materials Genome Institute, Shanghai University, No. 99 Shangda Road, Shanghai; 200444, China 3.School of Materials Science and Engineering, University of Science and Technology Beijing, No. 30 Xueyuan Road, Beijing; 10083, China |
First Author Affilication | Department of Materials Science and Engineering |
Corresponding Author Affilication | Department of Materials Science and Engineering |
First Author's First Affilication | Department of Materials Science and Engineering |
Recommended Citation GB/T 7714 |
Liu, Weishu,Han, Zhijia,Ji, Jialin,et al. Uplimit (ZT) |
APA |
Liu, Weishu,Han, Zhijia,Ji, Jialin,Feng, Tao,Yang, Jiong,&Zhang, Wenqing.(2023).Uplimit (ZT) |
MLA |
Liu, Weishu,et al."Uplimit (ZT) |
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