Scalable Polyimide-Organosilicate Hybrid Films for High-Temperature Capacitive Energy Storage

Dong, Jiufeng1,2,3; Li, Li1,2,3; Qiu, Peiqi1,4; Pan, Yupeng5,6; Niu, Yujuan1,2,3; Sun, Liang1,2,3; Pan, Zizhao1,2,3; Liu, Yuqi1,2,3; Tan, Li1,2,3; Xu, Xinwei1,2,3; Xu, Chen5,6; Luo, Guangfu1,4; Wang, Qing7; Wang, Hong1,2,3

2023-03-01

10.1002/adma.202211487

ADVANCED MATERIALS   Impact Factor & Quartile

0935-9648

1521-4095

High-temperature polymer dielectrics have broad application prospects in next-generation microelectronics and electrical power systems. However, the capacitive energy densities of dielectric polymers at elevated temperatures are severely limited by carrier excitation and transport. Herein, a molecular engineering strategy is presented to regulate the bulk-limited conduction in the polymer by bonding amino polyhedral oligomeric silsesquioxane (NH2-POSS) with the chain ends of polyimide (PI). Experimental studies and density functional theory (DFT) calculations demonstrate that the terminal group NH2-POSS with a wide-bandgap of E-g approximate to 6.6 eV increases the band energy levels of the PI and induces the formation of local deep traps in the hybrid films, which significantly restrains carrier transport. At 200 degrees C, the hybrid film exhibits concurrently an ultrahigh discharged energy density of 3.45 J cm(-3) and a high gravimetric energy density of 2.74 J g(-1), with the charge-discharge efficiency >90%, far exceeding those achieved in the dielectric polymers and nearly all other polymer nanocomposites. Moreover, the NH2-POSS terminated PI film exhibits excellent charge-discharge cyclability (>50000) and power density (0.39 MW cm(-3)) at 200 degrees C, making it a promising candidate for high-temperature high-energy-density capacitors. This work represents a novel strategy to scalable polymer dielectrics with superior capacitive performance operating in harsh environments.

capacitors elevated temperature energy storage hybrid films molecular engineering

SCI

English

NI Journal Papers

First ; Corresponding

National Key Research & Development Program[2021YFB3800603] ; National Natural Science Foundation of China[92066208] ; Shenzhen Science and Technology Program[KQTD20180411143514543] ; Guangdong Provincial Key Laboratory Program[2021B1212040001]

Chemistry ; Science & Technology - Other Topics ; Materials Science ; Physics

Chemistry, Multidisciplinary ; Chemistry, Physical ; Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter

WOS:000957465200001

WILEY-V C H VERLAG GMBH

MATERIALS SCIENCE

Web of Science

1.Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Guangdong, Peoples R China
2.Southern Univ Sci & Technol, Shenzhen Engn Res Ctr Novel Elect Informat Mat & D, Shenzhen 518055, Guangdong, Peoples R China
3.Southern Univ Sci & Technol, Guangdong Prov Key Lab Funct Oxide Mat & Devices, Shenzhen 518055, Guangdong, Peoples R China
4.Southern Univ Sci & Technol, Guangdong Prov Key Lab Computat Sci & Mat Design, Shenzhen 518055, Guangdong, Peoples R China
5.Southern Univ Sci & Technol, Shenzhen Grubbs Inst, Shenzhen 518055, Guangdong, Peoples R China
6.Southern Univ Sci & Technol, Dept Chem, Shenzhen 518055, Guangdong, Peoples R China
7.Penn State Univ, Dept Mat Sci & Engn, University Pk, PA 16802 USA

Dong, Jiufeng,Li, Li,Qiu, Peiqi,et al. Scalable Polyimide-Organosilicate Hybrid Films for High-Temperature Capacitive Energy Storage[J]. ADVANCED MATERIALS,2023.

Dong, Jiufeng.,Li, Li.,Qiu, Peiqi.,Pan, Yupeng.,Niu, Yujuan.,...&Wang, Hong.(2023).Scalable Polyimide-Organosilicate Hybrid Films for High-Temperature Capacitive Energy Storage.ADVANCED MATERIALS.

Dong, Jiufeng,et al."Scalable Polyimide-Organosilicate Hybrid Films for High-Temperature Capacitive Energy Storage".ADVANCED MATERIALS (2023).