中文版 | English
Title

From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, Applications

Author
Publication Years
2021
ISBN
9781118881620;9781118881477;
Abstract
FROM LED TO SOLID STATE LIGHTING A comprehensive practical reference complete with hs-on exercises experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, Applications
DOI
URL[Source Record]
Pages
1-247
Language
English
Scopus EID
2-s2.0-85150880072
Data Source
Scopus
SUSTech Authorship
Others
Citation statistics
Cited Times [WOS]:0
Document TypeBook
Identifierhttp://kc.sustech.edu.cn/handle/2SGJ60CL/524339
DepartmentSouthern University of Science and Technology
Affiliation
1.Mechanical Aerospace Engineering,United States
2.Foshan Research Institute for Smart Manufacturing,Hong Kong
3.Electronic Packaging Laboratory,Hong Kong
4.the Hong Kong University of Science Technology (HKUST),Kowloon,China
5.Systems Hub,HKUST Guangzhou Campus,China
6.HKUST LED-FPD Technology RandD Center,Foshan,Guangdong,China
7.IEEE,ASME,IMAPS,United States
8.Institute of Physics,United Kingdom
9.Electronic Packaging Laboratory,Hong Kong
10.Foshan Research Institute for Smart Manufacturing,Hong Kong
11.
12.Southern University of Science Technology (SUSTech),Shenzhen,Guangdong,China
13.advanced packaging platforms,RandD,industrialization,
Recommended Citation
GB/T 7714
Lee,Shi Wei Ricky,Lo,Jeffery C.C.,Tao,Mian,et al. From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, Applications[M],2021.
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