南方科技大学知识苑(SUSTech KC): 一种提升导电银胶热导率的方法、导电银胶及其应用

Title	一种提升导电银胶热导率的方法、导电银胶及其应用
Alternative Title	Method for improving heat conductivity of conductive silver adhesive, conductive silver adhesive and application of conductive silver adhesive
Author	祝渊; 鄂依阳; 迟克禹 ; 田兆波; 吕尤 ; 江帆 ; 周邵鑫
First Inventor	祝渊
Original applicant	南方科技大学 ; 小墨热管理材料技术(深圳)有限公司
First applicant	南方科技大学
Address of First applicant	518055 广东省深圳市南山区桃源街道学苑大道1088号
Current applicant	南方科技大学 ; 小墨热管理材料技术(深圳)有限公司
Address of Current applicant	518055 广东省深圳市南山区桃源街道学苑大道1088号 (广东,深圳,南山区)
First Current Applicant	南方科技大学
Address of First Current Applicant	518055 广东省深圳市南山区桃源街道学苑大道1088号 (广东,深圳,南山区)
Application Number	CN202210899117.2
Application Date	2022-07-28
Open (Notice) Number	CN115216228A
Date Available	2022-10-21
Status of Patent	实质审查
Legal Date	2022-11-08
Subtype	发明申请
SUSTech Authorship	First
Abstract	本发明属于胶黏剂领域，公开了一种提升导电银胶热导率的方法、导电银胶及其应用。该方法包括以下步骤：对导电银胶进行湿热处理，湿热处理的条件包括：温度70～120℃，湿度70～120RH％。本发明采用高温高湿方法来处理导电银胶，操作简单，同时能大幅度提升导电银胶的热导率。本发明还提出一种经上述方法处理后得到的导电银胶。这种导电银胶可用于光伏电池封装材料、电子产品制备或电子封装工艺中。
Other Abstract	The invention belongs to the field of adhesives, and discloses a method for improving the heat conductivity of a conductive silver adhesive, the conductive silver adhesive and application of the conductive silver adhesive. The method comprises the following steps: carrying out heat-moisture treatment on the conductive silver adhesive under the conditions that the temperature is 70-120 DEG C and the humidity is 70-120 RH%; the conductive silver adhesive is treated by adopting a high-temperature and high-humidity method, the operation is simple, and meanwhile, the heat conductivity of the conductive silver adhesive can be greatly improved. The invention further provides the conductive silver adhesive obtained after treatment through the method. The conductive silver adhesive can be used in photovoltaic cell packaging materials, electronic product preparation or electronic packaging technology.
CPC Classification Number	C09J5/06 ; C09J163/00 ; C09J9/02 ; C09J11/04 ; C08K2003/0806 ; C08K3/08 ; Y02E10/50
IPC Classification Number	C09J5/06 ; C09J163/00 ; C09J9/02 ; C09J11/04
INPADOC Legal Status	（ENTRY INTO FORCE OF REQUEST FOR SUBSTANTIVE EXAMINATION）[2022-11-08][CN]
INPADOC Patent Family Count	1
Extended Patent Family Count	1
Priority date	2022-07-28
Patent Agent	张建珍
Agency	广州嘉权专利商标事务所有限公司
URL	[Source Record]
Data Source	PatSnap
Document Type	Patent
Identifier	http://kc.sustech.edu.cn/handle/2SGJ60CL/531882
Department	SUSTech Institute of Microelectronics 创新创业学院
Recommended Citation GB/T 7714	祝渊,鄂依阳,迟克禹,等. 一种提升导电银胶热导率的方法、导电银胶及其应用.

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