Title | 数字微流控芯片 |
Alternative Title | Digital micro-fluidic chip
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Author | |
First Inventor | 程鑫
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Original applicant | 南方科技大学
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First applicant | 南方科技大学
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Address of First applicant | 518000 广东省深圳市南山区桃源街道学苑大道1088号
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Current applicant | 深圳市芯卫来科技有限公司
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Address of Current applicant | 518000 广东省深圳市龙华区民治街道龙塘社区卓越皇后道名苑一期6栋A座27A (广东,深圳,龙华区)
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First Current Applicant | 深圳市芯卫来科技有限公司
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Address of First Current Applicant | 518000 广东省深圳市龙华区民治街道龙塘社区卓越皇后道名苑一期6栋A座27A (广东,深圳,龙华区)
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Application Number | CN202122866200.3
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Application Date | 2021-11-22
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Open (Notice) Number | CN216354219U
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Date Available | 2022-04-19
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Publication Years | 2022-04-19
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Status of Patent | 授权
; 一案双申
; 权利转移
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Legal Date | 2022-04-19
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Subtype | 实用新型
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SUSTech Authorship | First
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Abstract | 本实用新型提供一种数字微流控芯片,其包括有源矩阵薄膜晶体管阵列基板、分立式疏水膜、上盖板、沉积在上盖板底部的疏水膜以及注入所述分立式疏水膜和疏水膜之间的液滴和硅油;所述有源矩阵薄膜晶体管阵列基板包括多个高压薄膜晶体管,每个高压薄膜晶体管包括串联连接的第一TFT和第二TFT、以及串联连接第一TFT和第二TFT的源漏连接电极。本实用新型数字微流控芯片采用高压薄膜晶体管,高压薄膜晶体管可以提供超过200V以上的电压,有利于提高数字微流控芯片的通用性;高压薄膜晶体管可以施加AC信号,提高数字微流控芯片的使用寿命。 |
Other Abstract | The utility model provides a digital micro-fluidic chip. The digital micro-fluidic chip comprises an active matrix thin film transistor array substrate, a discrete hydrophobic membrane, an upper cover plate, a hydrophobic membrane deposited at the bottom of the upper cover plate, liquid drops and silicone oil, wherein the liquid drops and the silicone oil are injected between the discrete hydrophobic membrane and the hydrophobic membrane; the active matrix thin film transistor array substrate comprises a plurality of high-voltage thin film transistors, and each high-voltage thin film transistor comprises a first TFT, a second TFT and a source drain connecting electrode, wherein the first TFT and the second TFT are connected in series, and the source drain connecting electrode is connected with the first TFT and the second TFT in series. According to the digital micro-fluidic chip disclosed by the utility model, the high-voltage thin film transistor is adopted, and the high-voltage thin film transistor can provide a voltage exceeding 200V, so that the universality of the digital micro-fluidic chip can be improved; and the high-voltage thin film transistor can apply an AC signal, so that the service life of the digital micro-fluidic chip is prolonged. |
IPC Classification Number | H01L27/12
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INPADOC Legal Status | (TRANSFER OF PATENT RIGHT)[2023-01-13][CN]
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INPADOC Patent Family Count | 1
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Extended Patent Family Count | 2
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Priority date | 2021-11-22
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Patent Agent | 满群
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Agency | 深圳市惠邦知识产权代理事务所
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URL | [Source Record] |
Data Source | PatSnap
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Document Type | Patent |
Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/531938 |
Department | Department of Materials Science and Engineering |
Recommended Citation GB/T 7714 |
程鑫,刘荣跃,刘嘉泽,等. 数字微流控芯片[P]. 2022-04-19.
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