| Title | 均温板传热性能测试装置及测试方法 |
| Alternative Title | Vapor chamber heat transfer performance test device and test method
|
| Author | |
| First Inventor | 祝渊
|
| Original applicant | 东莞捷荣技术股份有限公司
; 南方科技大学
|
| First applicant | 东莞捷荣技术股份有限公司
|
| Address of First applicant | 523841 广东省东莞市长安镇新安工业园
|
| Current applicant | 东莞捷荣技术股份有限公司
; 南方科技大学
|
| Address of Current applicant | 523841 广东省东莞市长安镇新安工业园
|
| First Current Applicant | 东莞捷荣技术股份有限公司
|
| Address of First Current Applicant | 523841 广东省东莞市长安镇新安工业园
|
| Application Number | CN202010994088.9
|
| Application Date | 2020-09-21
|
| Open (Notice) Number | CN112014425A
|
| Date Available | 2020-12-01
|
| Status of Patent | 实质审查
; 一案双申
|
| Legal Date | 2020-12-18
|
| Subtype | 发明申请
|
| SUSTech Authorship | Others
|
| Abstract | 本发明公开了一种均温板传热性能测试装置及测试方法，包括：冷却板、加热器和温度检测装置，冷却板的冷却面用于与均温板的第一侧面贴合，冷却板上开有贯穿冷却面的通孔，冷却板中围绕通孔设置有冷却水道，冷却水道设置有进水口和出水口；加热器包括热源和导热柱，热源位于导热柱的一端，导热柱远离热源的一端与均温板的第二侧面贴合，且导热柱远离热源的一端位于通孔在第二侧面的投影区域内，第二侧面与第一侧面相对设置；温度检测装置用于测量第一侧面上的任一点的温度，以及用于检测导热柱的外表面上的任一点的温度。本发明能够对均温板表面的温度进行准地测量，减小均温板的传热性能的测量误差。 |
| Other Abstract | The invention discloses a vapor chamber heat transfer performance test device and test method. The device comprises a cooling plate, a heater and a temperature detection device; the cooling surface ofthe cooling plate is used for being attached to the first side face of the vapor chamber, a through hole penetrating through the cooling surface is formed in the cooling plate, a cooling water channel is formed in the cooling plate around the through hole, and a water inlet and a water outlet are formed in the cooling water channel; the heater comprises a heat source and a heat conduction column,wherein the heat source is located at one end of the heat conduction column, and the end, away from the heat source, of the heat conduction column is attached to the second side face of the vapor chamber and located in the projection area of the through hole in the second side face which is opposite to the first side face; and the temperature detection device is used for measuring the temperatureof any point on the first side face and detecting the temperature of any point on the outer surface of the heat conduction column. According to the invention, the temperature of the surface of the vapor chamber can be accurately measured, and the measurement error of the heat transfer performance of the vapor chamber is reduced. |
| CPC Classification Number | G01N25/18
; G01N25/20
|
| IPC Classification Number | G01N25/20
; G01N25/18
|
| INPADOC Legal Status | （ENTRY INTO FORCE OF REQUEST FOR SUBSTANTIVE EXAMINATION）[2020-12-18][CN]
|
| INPADOC Patent Family Count | 1
|
| Extended Patent Family Count | 2
|
| Priority date | 2020-09-21
|
| Patent Agent | 谢岳鹏
|
| Agency | 广州嘉权专利商标事务所有限公司
|
| URL | [Source Record] |
| Data Source | PatSnap
|
| Document Type | Patent |
| Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/532359 |
| Department | SUSTech Institute of Microelectronics |
| Recommended Citation GB/T 7714 |
祝渊,陈安琪,杨俊逸,等. 均温板传热性能测试装置及测试方法.
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