| Title | 一种Micro-LED芯片的巨量转移方法 |
| Alternative Title | Mass transfer method for Micro-LED chips
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| Author | |
| First Inventor | 刘召军
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| Original applicant | 南方科技大学
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| First applicant | 南方科技大学
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| Address of First applicant | 518055 广东省深圳市南山区西丽学苑大道1088号
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| Current applicant | 南方科技大学
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| Address of Current applicant | 518055 广东省深圳市南山区西丽学苑大道1088号 (广东,深圳,南山区)
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| First Current Applicant | 南方科技大学
|
| Address of First Current Applicant | 518055 广东省深圳市南山区西丽学苑大道1088号 (广东,深圳,南山区)
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| Application Number | CN202111051684.4
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| Application Date | 2021-09-08
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| Open (Notice) Number | CN113690171A
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| Date Available | 2021-11-23
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| Status of Patent | 实质审查
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| Legal Date | 2021-12-10
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| Subtype | 发明申请
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| SUSTech Authorship | First
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| Abstract | 本发明实施例公开了一种Micro‑LED芯片的巨量转移方法，包括：提供一蓝宝石衬底，在蓝宝石衬底上形成LED芯片阵列；在LED芯片阵列的第一表面黏附蓝膜并去除蓝宝石衬底；拉伸蓝膜以使LED芯片阵列中的芯片间距达到预设距离；通过超分辨率PDMS印章吸附LED芯片阵列的第二表面并去除蓝膜，其中，超分辨率PDMS印章吸附LED芯片阵列的区域包括由多个孔洞组成的孔洞阵列，孔洞的尺寸小于LED芯片阵列的芯片尺寸，孔洞阵列的孔洞密度大于LED芯片阵列的芯片密度；移动超分辨率PDMS印章至驱动基板后剥离超分辨率PDMS印章，以使LED芯片阵列转移至驱动基板。本发明实施例在印章吸附LED芯片时无需对准，即简化了操作，又加快了转移速度，进而提高转移效率和精确性。 |
| Other Abstract | The embodiment of the invention discloses a mass transfer method of Micro-LED chips, which comprises the following steps of: providing a sapphire substrate, and forming an LED chip array on the sapphire substrate; adhering a blue film on the first surface of the LED chip array and removing the sapphire substrate; stretching the blue film to enable the distance between chips in the LED chip array to reach a preset distance; absorbing the second surface of the LED chip array through a super-resolution PDMS seal, and removing the blue film, wherein the area where the super-resolution PDMS seal adsorbs the LED chip array comprises a hole array composed of a plurality of holes, the size of the holes is smaller than the chip size of the LED chip array, and the hole density of the hole array is larger than the chip density of the LED chip array; and moving the super-resolution PDMS seal to the driving substrate, and then stripping the super-resolution PDMS seal, so that the LED chip array is transferred to the driving substrate. According to the embodiment of the invention, alignment is not needed when the seal adsorbs the LED chip, so that the operation is simplified, the transfer speed is accelerated, and the transfer efficiency and accuracy are improved. |
| CPC Classification Number | H01L21/6838
; H01L21/6835
; H01L27/156
|
| IPC Classification Number | H01L21/683
; H01L27/15
|
| INPADOC Legal Status | （ENTRY INTO FORCE OF REQUEST FOR SUBSTANTIVE EXAMINATION）[2021-12-10][CN]
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| INPADOC Patent Family Count | 1
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| Extended Patent Family Count | 1
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| Priority date | 2021-09-08
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| Patent Agent | 潘登
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| Agency | 北京品源专利代理有限公司
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| URL | [Source Record] |
| Data Source | PatSnap
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| Document Type | Patent |
| Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/532854 |
| Department | Department of Electrical and Electronic Engineering 工学院_材料科学与工程系 |
| Recommended Citation GB/T 7714 |
刘召军,容沃铖,罗冰清,等. 一种Micro-LED芯片的巨量转移方法.
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