南方科技大学知识苑(SUSTech KC): 一种MEMS微热板

Title	一种MEMS微热板
Alternative Title	MEMS low -grade fever board
Author	程鑫; 陈宇龙; 权敦航; 李以文; 王剑; 高一帆
First Inventor	程鑫
Original applicant	南方科技大学
First applicant	南方科技大学
Address of First applicant	518000 广东省深圳市南山区西丽学苑大道1088号
Current applicant	南方科技大学
Address of Current applicant	518000 广东省深圳市南山区西丽学苑大道1088号 (广东,深圳,南山区)
First Current Applicant	南方科技大学
Address of First Current Applicant	518000 广东省深圳市南山区西丽学苑大道1088号 (广东,深圳,南山区)
Application Number	CN201721047736.X
Application Date	2017-08-21
Open (Notice) Number	CN207375750U
Date Available	2018-05-18
Publication Years	2018-05-18
Status of Patent	授权
Legal Date	2018-05-18
Subtype	实用新型
SUSTech Authorship	First
Abstract	本实用新型实施例公开了一种MEMS微热板，该MEMS微热板包括：硅基衬底，硅基衬底包括测量区域和加热区域；第一介电层，位于硅基衬底的上表面；加热电极和测量电极，加热电极和测量电极同层绝缘设置且均位于第一介电层上，加热电极对应设置在加热区域，以及测量电极对应设置在测量区域；隔热凹槽，位于硅基衬底的下表面且贯穿硅基衬底，以及隔热凹槽的槽底在垂直于硅基衬底的方向上覆盖加热区域。本实用新型实施例中，MEMS微热板的加热电极和测量电极采用共平面设计，只需要沉积一层金属电极层并采用一次金属图案化工艺即可完成；与现有技术相比，降低了加工工艺复杂度、减少了制造工序、并降低了制造成本，还提高MEMS微热板的制造良率。
Other Abstract	The embodiment of the utility model discloses MEMS low -grade fever board, this MEMS low -grade fever board includes: silica -based substrate, silica -based substrate is including measuring region andheating region, first dielectric layer is located the upper surface of silica -based substrate, heating electrode and measuring electrode, heating electrode and measuring electrode just all are located first dielectric layer with layer insulating a setting, and heating electrode corresponds the setting at the heating region to and measuring electrode corresponds the setting in the measurement region, thermal -insulated recess is located the lower surface of silica -based substrate and runs through silica -based substrate to and the tank bottom of thermal -insulated recess covers the heating region in the orientation of the silica -based substrate of perpendicular to. The embodiment of the utility model provides an in, MEMS low -grade fever board's heating electrode and measuring electrodeadopt the same plane design, only need deposit one deck metal electrode layer and adopt a metal pattern chemical industry skill to accomplish, compared with the prior art, reduced the processing technology complexity, reduced the manufacturing process and reduced manufacturing cost, still improved MEMS low -grade fever board's manufacturing yield.
CPC Classification Number	B81B7/0096 ; B81C99/0035 ; H05B3/03 ; H05B3/283
IPC Classification Number	B81B7/00 ; B81C99/00 ; H05B3/03 ; H05B3/28
INPADOC Legal Status	（+PATENT GRANT）[2018-05-18][CN]
INPADOC Patent Family Count	2
Extended Patent Family Count	2
Priority country	CN
Priority number	201710691051.7
Priority date	2017-08-14
Patent Agent	孟金喆
Agency	北京品源专利代理有限公司
URL	[Source Record]
Data Source	PatSnap
Document Type	Patent
Identifier	http://kc.sustech.edu.cn/handle/2SGJ60CL/533151
Department	Department of Materials Science and Engineering 理学院_物理系工学院_电子与电气工程系
Recommended Citation GB/T 7714	程鑫,陈宇龙,权敦航,等. 一种MEMS微热板[P]. 2018-05-18.

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