南方科技大学知识苑(SUSTech KC): 全聚合物多层结构复合材料及其制备方法和应用

Title	全聚合物多层结构复合材料及其制备方法和应用
Alternative Title	All-polymer multilayered composite material and preparation method and application thereof
Author	汪宏; 陈杰 ; 牛玉娟
First Inventor	汪宏
Original applicant	南方科技大学
First applicant	南方科技大学
Address of First applicant	518055 广东省深圳市南山区西丽学苑大道1088号
Current applicant	南方科技大学
Address of Current applicant	518055 广东省深圳市南山区西丽学苑大道1088号 (广东,深圳,南山区)
First Current Applicant	南方科技大学
Address of First Current Applicant	518055 广东省深圳市南山区西丽学苑大道1088号 (广东,深圳,南山区)
Application Number	CN201811115909.6
Application Date	2018-09-25
Open (Notice) Number	CN110070991A
Date Available	2019-07-30
Status of Patent	实质审查
Legal Date	2019-08-23
Subtype	发明申请
SUSTech Authorship	First
Abstract	本发明涉及介电材料技术领域，具体提供一种全聚合物多层结构复合材料及其制备方法和应用。该全聚合物多层结构复合材料包括第一聚合物层、层叠于第一聚合物层表面的第二聚合物层以及层叠于第二聚合物层表面的第三聚合物层；所述第一聚合物层、第二聚合物层、第三聚合物层中至少有一层的电阻率与其他层的电阻率不相同，且至少有一层的介电常数与其他层的介电常数不相同。本发明的复合材料兼具高储能密度、高储能效率和良好的机械加工性，其击穿场强≥400MV/m，放电效率≥70％，储能密度≥10J/cm3，因此特别适合作为介电材料应用于各类电子器件中。
Other Abstract	The present invention relates to the technical field of dielectric materials, and specifically provides an all-polymer multilayered composite material and a preparation method and an application thereof. The all-polymer multilayered composite material includes a first polymer layer, a second polymer layer stacked on the surface of the first polymer layer and a third polymer layer stacked on the surface of the second polymer layer. In the first polymer layer, the second polymer layer and the third polymer layer, the electrical resistivity and the dielectric constant of at least one layer are different from that of the other layers. The composite material of the invention has a high energy storage density, a high energy storage efficiency and good machinability; the breakdown field strengthis greater than or equal to 400MV/m; the discharging efficiency is greater than or equal to 70%; and the storage energy density is greater than or equal to 10J/cm<3>. So the composite material is especially suitable for the applications in various electronic devices as a dielectric material.
CPC Classification Number	C09D123/12 ; C09D127/16 ; C09D133/12 ; C09D179/02 ; H01G4/18
IPC Classification Number	H01G4/18 ; C09D133/12 ; C09D127/16 ; C09D123/12 ; C09D179/02
INPADOC Legal Status	（ENTRY INTO FORCE OF REQUEST FOR SUBSTANTIVE EXAMINATION）[2019-08-23][CN]
INPADOC Patent Family Count	1
Extended Patent Family Count	1
Priority date	2018-09-25
Patent Agent	官建红
Agency	深圳中一专利商标事务所
URL	[Source Record]
Data Source	PatSnap
Document Type	Patent
Identifier	http://kc.sustech.edu.cn/handle/2SGJ60CL/533747
Department	Graduate school 工学院_材料科学与工程系
Recommended Citation GB/T 7714	汪宏,陈杰,牛玉娟. 全聚合物多层结构复合材料及其制备方法和应用.

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