南方科技大学知识苑(SUSTech KC): 一种封装结构及显示器

Title	一种封装结构及显示器
Alternative Title	Packaging structure and display
Author	王新中; 赵志力; 王恺; 孙小卫; 陈明祥
First Inventor	王新中
Original applicant	深圳信息职业技术学院 ; 南方科技大学
First applicant	深圳信息职业技术学院
Address of First applicant	518000 广东省深圳市龙岗区龙城街道龙翔大道2188号
Current applicant	深圳信息职业技术学院 ; 南方科技大学
Address of Current applicant	518000 广东省深圳市龙岗区龙城街道龙翔大道2188号 (广东,深圳,龙岗区)
First Current Applicant	深圳信息职业技术学院
Address of First Current Applicant	518000 广东省深圳市龙岗区龙城街道龙翔大道2188号 (广东,深圳,龙岗区)
Application Number	CN201920923575.9
Application Date	2019-06-18
Open (Notice) Number	CN210837804U
Date Available	2020-06-23
Publication Years	2020-06-23
Status of Patent	授权
Legal Date	2020-06-23
Subtype	实用新型
SUSTech Authorship	Others
Abstract	本实用新型涉及封装技术领域，提供一种封装结构，包括灯源板及设置在灯源板上的多个芯片，还包括量子点及对量子点具有吸附力的光刻胶层，光刻胶层设于各芯片的出光侧，光刻胶层上设有多个通槽，各通槽与各芯片一一对应设置，芯片顶端与通槽底端连接并密封通槽底端，量子点涂设于芯片顶端并容置于通槽中。本实用新型还提供一种显示器，包括封装结构。通过在芯片上设置具有通槽的光刻胶层，芯片与通槽一一对应设置，且芯片顶端连接并密封通槽底端，使得通槽的侧壁的吸附力能够有效地平衡量子点自身的流体力，从而消除咖啡环效应，使得通槽内的量子点更加均匀地分布，从而实现均匀的颜色显示。
Other Abstract	The utility model relates to the technical field of packaging. Packaging structure, the LED lamp comprises a lamp source plate and a plurality of chips arranged on the lamp source plate, wherein the photoresist layer is arranged on the light emitting side of each chip, a plurality of through grooves are formed in the photoresist layer, the through grooves and the chips are arranged in a one-to-onecorrespondence mode, the top ends of the chips are connected with the bottom ends of the through grooves and seal the bottom ends of the through grooves, and the quantum dots are arranged at the topends of the chips in a coating mode and contained in the through grooves. The utility model further provides a display which comprises the packaging structure. A photoresist layer with a through groove is arranged on a chip; the chips and the through grooves are arranged in a one-to-one correspondence manner, and the top ends of the chips are connected with and seal the bottom ends of the throughgrooves, so that the adsorption force of the side walls of the through grooves can effectively balance the fluid force of the quantum dots, the coffee ring effect is eliminated, the quantum dots in the through grooves are more uniformly distributed, and uniform color display is realized.
IPC Classification Number	H01L33/50 ; H01L33/48 ; G09F9/33
INPADOC Legal Status	（+PATENT GRANT）[2020-06-23][CN]
INPADOC Patent Family Count	1
Extended Patent Family Count	1
Priority date	2019-06-18
Patent Agent	黄志云
Agency	深圳中一联合知识产权代理有限公司
URL	[Source Record]
Data Source	PatSnap
Document Type	Patent
Identifier	http://kc.sustech.edu.cn/handle/2SGJ60CL/533897
Department	Department of Electrical and Electronic Engineering
Recommended Citation GB/T 7714	王新中,赵志力,王恺,等. 一种封装结构及显示器[P]. 2020-06-23.

Files in This Item:
There are no files associated with this item.

If you have any objections to this item, please fill out the form below and the administrator will contact you as soon as possible.
Content:
Email：	*
Affiliation Sequential No:
Verification Code:	Refresh

Any comments and suggestions are welcomed.
Title:	*
Content:
Email：	*
Verification Code:	Refresh