南方科技大学知识苑(SUSTech KC): 激光加工装置、方法及设备

Title	激光加工装置、方法及设备
Alternative Title	Laser processing device, method and equipment
Author	徐少林; 郭杨; 邱佩
First Inventor	徐少林
Original applicant	南方科技大学
First applicant	南方科技大学
Address of First applicant	518055 广东省深圳市南山区西丽学苑大道1088号
Current applicant	南方科技大学
Address of Current applicant	518055 广东省深圳市南山区西丽学苑大道1088号 (广东,深圳,南山区)
First Current Applicant	南方科技大学
Address of First Current Applicant	518055 广东省深圳市南山区西丽学苑大道1088号 (广东,深圳,南山区)
Application Number	CN202111352236.8
Application Date	2021-11-16
Open (Notice) Number	CN114211111A
Date Available	2022-03-22
Status of Patent	实质审查
Legal Date	2022-04-08
Subtype	发明申请
SUSTech Authorship	First
Abstract	本申请公开了一种激光加工装置、方法及设备。本申请激光加工装置包括液膜厚度控制组件、激光调制组件和聚焦组件。液膜厚度控制组件用于获取液膜厚度，并对液膜厚度进行调整；激光调制组件用于对激光光束进行调制以得到第一光束；聚焦组件用于将第一光束聚焦于覆盖有液膜的待加工材料表面，并对待加工材料进行加工。本申请通过液膜厚度控制组件获取液膜厚度并对液膜厚度进行调整，能够使激光辐射产生的气泡发生非对称湮灭，产生向下的高速微射流，高速微射流携带加工产生的碎屑以及气泡移动，离开加工区域，从而提高加工的质量和加工的效率；此外，调制后的第一光束能够对待加工材料实现高质量加工，提高加工的效率。
Other Abstract	The invention discloses a laser processing device, method and equipment. The laser processing device comprises a liquid film thickness control assembly, a laser modulation assembly and a focusing assembly. The liquid film thickness control assembly is used for obtaining the thickness of the liquid film and adjusting the thickness of the liquid film; the laser modulation assembly is used for modulating the laser beam to obtain a first light beam; the focusing assembly is used for focusing the first light beam on the surface of the to-be-processed material covered with the liquid film and processing the to-be-processed material. The liquid film thickness control assembly is used for obtaining the liquid film thickness and adjusting the liquid film thickness, bubbles generated by laser radiation can be subjected to asymmetric annihilation, downward high-speed micro-jet is generated, the high-speed micro-jet carries chippings and bubbles generated by machining to move and leave a machining area, and therefore the machining quality and the machining efficiency are improved; in addition, the modulated first light beam can achieve high-quality machining of the to-be-machined material, and the machining efficiency is improved.
CPC Classification Number	B23K26/122 ; B23K26/702 ; B23K26/064 ; B23K26/032 ; B23K26/36 ; B23K26/0648 ; B23K26/0643
IPC Classification Number	B23K26/122 ; B23K26/70 ; B23K26/064 ; B23K26/03 ; B23K26/36
INPADOC Legal Status	（ENTRY INTO FORCE OF REQUEST FOR SUBSTANTIVE EXAMINATION）[2022-04-08][CN]
INPADOC Patent Family Count	1
Extended Patent Family Count	1
Priority date	2021-11-16
Patent Agent	洪铭福
Agency	广州嘉权专利商标事务所有限公司
URL	[Source Record]
Data Source	PatSnap
Document Type	Patent
Identifier	http://kc.sustech.edu.cn/handle/2SGJ60CL/533933
Department	Department of Mechanical and Energy Engineering
Recommended Citation GB/T 7714	徐少林,郭杨,邱佩. 激光加工装置、方法及设备.

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