南方科技大学知识苑(SUSTech KC): 非接触式薄型均温板热性能量测装置

Title	非接触式薄型均温板热性能量测装置
Alternative Title	Non-contact thin vapor chamber thermal performance measuring device
Author	祝渊; 陈安琪; 李芳寿; 李卓翰
First Inventor	祝渊
Original applicant	南方科技大学 ; 台湾瑞领科技股份有限公司
First applicant	南方科技大学
Address of First applicant	518000 广东省深圳市南山区学苑大道1088号
Current applicant	南方科技大学 ; 台湾瑞领科技股份有限公司
Address of Current applicant	518000 广东省深圳市南山区学苑大道1088号 (广东,深圳,南山区)
First Current Applicant	南方科技大学
Address of First Current Applicant	518000 广东省深圳市南山区学苑大道1088号 (广东,深圳,南山区)
Application Number	CN202110037550.0
Application Date	2021-01-12
Open (Notice) Number	CN114755259A
Date Available	2022-07-15
Status of Patent	实质审查 ; 一案双申
Legal Date	2022-08-09
Subtype	发明申请
SUSTech Authorship	First
Abstract	本发明公开了一种非接触式薄型均温板热性能量测装置，主要可应用于不同形状、尺寸的薄型均温板，通过搭配非接触式的雷射加热器、非接触式的红外温度传感器以及非接触式的供气冷却模块，在一绝缘恒温的腔体内进行薄型均温板热性能参数的量测，例如：薄型均温板两端温度差、热阻等，有别于现有技术是利用加热水浴或铜块进行薄型均温板加热，以及利用接触式温度传感器进行薄型均温板的温度量测，故可提高量测结果的精准度及效率。
Other Abstract	The invention discloses a non-contact thin vapor chamber thermal performance measuring device, which can be mainly applied to thin vapor chambers with different shapes and sizes, and can measure the thermal performance of the thin vapor chamber by matching a non-contact laser heater, a non-contact infrared temperature sensor and a non-contact air supply cooling module. Measurement of thermal performance parameters of the thin vapor chamber, such as temperature difference and thermal resistance of two ends of the thin vapor chamber, is carried out in an insulated constant-temperature cavity, and is different from the prior art in which the thin vapor chamber is heated by using a heating water bath or a copper block and temperature measurement of the thin vapor chamber is carried out by using a contact temperature sensor. Therefore, the accuracy and the efficiency of the measurement result can be improved.
CPC Classification Number	G01N25/20
IPC Classification Number	G01N25/20
INPADOC Legal Status	（ENTRY INTO FORCE OF REQUEST FOR SUBSTANTIVE EXAMINATION）[2022-08-09][CN]
INPADOC Patent Family Count	1
Extended Patent Family Count	2
Priority date	2021-01-12
Patent Agent	唐致明
Agency	广州嘉权专利商标事务所有限公司
URL	[Source Record]
Data Source	PatSnap
Document Type	Patent
Identifier	http://kc.sustech.edu.cn/handle/2SGJ60CL/534111
Department	SUSTech Institute of Microelectronics
Recommended Citation GB/T 7714	祝渊,陈安琪,李芳寿,等. 非接触式薄型均温板热性能量测装置.

Files in This Item:
There are no files associated with this item.

If you have any objections to this item, please fill out the form below and the administrator will contact you as soon as possible.
Content:
Email：	*
Affiliation Sequential No:
Verification Code:	Refresh

Any comments and suggestions are welcomed.
Title:	*
Content:
Email：	*
Verification Code:	Refresh