| Title | Analytical Post-voiding Modeling and Efficient Characterization of EM Failure Effects under Time-dependent Current Stressing |
| Author | |
| Publication Years | 2023
|
| DOI | |
| Source Title | |
| ISSN | 1937-4151
|
| Volume | PPIssue:99Pages:1-1 |
| Keywords | |
| URL | [Source Record] |
| SUSTech Authorship | Others
|
| ESI Research Field | ENGINEERING
|
| Data Source | IEEE
|
| PDF url | https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10146025 |
| Citation statistics |
Cited Times [WOS]:0
|
| Document Type | Journal Article |
| Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/549041 |
| Department | SUSTech Institute of Microelectronics |
| Affiliation | 1.Department of Micro/Nano Electronics, Shanghai Jiao Tong University, China 2.Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong, Hong Kong 3.School of Microelectronics, Southern University of Science and Technology, China |
| Recommended Citation GB/T 7714 |
Tianshu Hou,Ngai Wong,Quan Chen,et al. Analytical Post-voiding Modeling and Efficient Characterization of EM Failure Effects under Time-dependent Current Stressing[J]. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems,2023,PP(99):1-1.
|
| APA |
Tianshu Hou,Ngai Wong,Quan Chen,Zhigang Ji,&Hai-Bao Chen.(2023).Analytical Post-voiding Modeling and Efficient Characterization of EM Failure Effects under Time-dependent Current Stressing.IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems,PP(99),1-1.
|
| MLA |
Tianshu Hou,et al."Analytical Post-voiding Modeling and Efficient Characterization of EM Failure Effects under Time-dependent Current Stressing".IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems PP.99(2023):1-1.
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| Files in This Item: | There are no files associated with this item. | |||||
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