Integrated Sensing and Communications With Reconfigurable Intelligent Surfaces: From signal modeling to processing

Sundeep Prabhakar Chepuri1; Nir Shlezinger2; Fan Liu3; George C. Alexandropoulos4; Stefano Buzzi5; Yonina C. Eldar6

2023-09

10.1109/MSP.2023.3279986

IEEE Signal Processing Magazine   Impact Factor & Quartile

1558-0792

Couplings Wireless sensor networks Wireless networks Millimeter wave technology Signal processing Sensors Reliability

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ENGINEERING

IEEE

1.Department of Electrical and Computer Engineering, Indian Institute of Science, Bengaluru, India
2.School of Electrical and Computer Engineering, Ben-Gurion University of the Negev, Be’er Sheva, Israel
3.Southern University of Science and Technology, Shenzhen, China
4.Department of Informatics and Telecommunications, School of Sciences, National and Kapodistrian University of Athens, Athens, Greece
5.University of Cassino and Lazio Meridionale, Cassino, Italy
6.Department of Mathematics and Computer Science, Weizmann Institute of Science, Rehovot, Israel

Sundeep Prabhakar Chepuri,Nir Shlezinger,Fan Liu,et al. Integrated Sensing and Communications With Reconfigurable Intelligent Surfaces: From signal modeling to processing[J]. IEEE Signal Processing Magazine,2023,40(6):41-62.

Sundeep Prabhakar Chepuri,Nir Shlezinger,Fan Liu,George C. Alexandropoulos,Stefano Buzzi,&Yonina C. Eldar.(2023).Integrated Sensing and Communications With Reconfigurable Intelligent Surfaces: From signal modeling to processing.IEEE Signal Processing Magazine,40(6),41-62.

Sundeep Prabhakar Chepuri,et al."Integrated Sensing and Communications With Reconfigurable Intelligent Surfaces: From signal modeling to processing".IEEE Signal Processing Magazine 40.6(2023):41-62.