Title | Carrier transport mechanism of Mg/Pt/Au Ohmic contact on p-GaN/AlGaN/GaN platform with ultra-low resistivity |
Author | |
Corresponding Author | Wang,Qing |
Publication Years | 2023-08-28
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DOI | |
Source Title | |
ISSN | 0003-6951
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EISSN | 1077-3118
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Volume | 123Issue:9 |
Abstract | In this work, the carrier transport mechanism of Mg/Pt/Au Ohmic contact on p-GaN/AlGaN/GaN with a very low specific contact resistivity of 1.98 × 10Ω cm is investigated. Secondary ion mass spectroscopy measurement results show that the Mg concentration near the p-GaN surface increases form 8 × 10 to 7 × 10/cm for Mg/Pt/Au contact after annealing. It indicates that Mg atoms from the Mg/Pt/Au metal stack diffuse into the p-GaN during annealing, forming a heavily Mg doped p-GaN layer with a depth of about 3 nm. The sheet resistance R depends on temperature for Mg/Pt/Au contacts on p-GaN/GaN, indicating that the influence of 2DHG on carrier transport mechanisms at the metal/p-GaN interface was eliminated. For Mg/Pt/Au contacts at ≥360 K, specific contact resistivity reasonably follows T, which indicates that the band conduction of Schottky theory dominates the carrier transport. For Mg/Pt/Au contacts at 200-360 K, the electrical resistivity reasonably follows T, indicating variable-range hopping (VRH) conduction through Mg-related deep-level defects (DLD). Based on the VRH conduction model, the effective barrier height (qφ) of the Mg-related DLD band is extracted as 0.265 eV, which well matches the excellent Ohmic contact. |
URL | [Source Record] |
Indexed By | |
Language | English
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Important Publications | NI Journal Papers
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SUSTech Authorship | First
; Corresponding
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Funding Project | This work was supported by Fabrication of Normally-Off GaN Devices based on |
WOS Research Area | Physics
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WOS Subject | Physics, Applied
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WOS Accession No | WOS:001057244000002
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Publisher | |
ESI Research Field | PHYSICS
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Scopus EID | 2-s2.0-85169978677
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Data Source | Scopus
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Citation statistics |
Cited Times [WOS]:0
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Document Type | Journal Article |
Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/559704 |
Department | SUSTech Institute of Microelectronics |
Affiliation | 1.School of Microelectronics,Southern University of Science and Technology,Shenzhen,518055,China 2.Harbin Institute of Technology,Harbin,150006,China 3.Maxscend Microelectrics Company Limited,Wuxi,214072,China 4.Engineering Research Center of Integrated Circuits for Next-Generation Communications,Ministry of Education,Southern University of Science and Technology,Shenzhen,518055,China 5.GaN Device Engineering Technology Research Center of Guangdong,Southern University of Science and Technology,Shenzhen,518055,China 6.Engineering Research Center of Three Dimensional Integration in Guangdong Province,Southern University of Science and Technology,Shenzhen,518055,China |
First Author Affilication | SUSTech Institute of Microelectronics |
Corresponding Author Affilication | SUSTech Institute of Microelectronics; Southern University of Science and Technology |
First Author's First Affilication | SUSTech Institute of Microelectronics |
Recommended Citation GB/T 7714 |
Tang,Chuying,Fu,Chun,Jiang,Yang,et al. Carrier transport mechanism of Mg/Pt/Au Ohmic contact on p-GaN/AlGaN/GaN platform with ultra-low resistivity[J]. Applied Physics Letters,2023,123(9).
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APA |
Tang,Chuying.,Fu,Chun.,Jiang,Yang.,He,Minghao.,Deng,Chenkai.,...&Yu,Hong Yu.(2023).Carrier transport mechanism of Mg/Pt/Au Ohmic contact on p-GaN/AlGaN/GaN platform with ultra-low resistivity.Applied Physics Letters,123(9).
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MLA |
Tang,Chuying,et al."Carrier transport mechanism of Mg/Pt/Au Ohmic contact on p-GaN/AlGaN/GaN platform with ultra-low resistivity".Applied Physics Letters 123.9(2023).
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