Title | High-Resolution Optical Three-Axis Tactile Microsensor Based on III-Nitride Devices with Integrated PDMS Bumps |
Author | |
Publication Years | 2023
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DOI | |
Source Title | |
ISSN | 1558-0563
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Volume | PPIssue:99Pages:1-1 |
Keywords | |
URL | [Source Record] |
SUSTech Authorship | First
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ESI Research Field | ENGINEERING
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Data Source | IEEE
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PDF url | https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10287376 |
Citation statistics | |
Document Type | Journal Article |
Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/582731 |
Department | SUSTech Institute of Microelectronics |
Affiliation | 1.School of Microelectronics, Southern University of Science and Technology, Shenzhen, China 2.Foshan Electrical and Lighting Company, Ltd, Foshan, China |
First Author Affilication | SUSTech Institute of Microelectronics |
First Author's First Affilication | SUSTech Institute of Microelectronics |
Recommended Citation GB/T 7714 |
Jiahao Yin,Yumeng Luo,Liang Chen,et al. High-Resolution Optical Three-Axis Tactile Microsensor Based on III-Nitride Devices with Integrated PDMS Bumps[J]. IEEE Electron Device Letters,2023,PP(99):1-1.
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APA |
Jiahao Yin,Yumeng Luo,Liang Chen,Qing Wang,Hongyu Yu,&Kwai Hei Li.(2023).High-Resolution Optical Three-Axis Tactile Microsensor Based on III-Nitride Devices with Integrated PDMS Bumps.IEEE Electron Device Letters,PP(99),1-1.
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MLA |
Jiahao Yin,et al."High-Resolution Optical Three-Axis Tactile Microsensor Based on III-Nitride Devices with Integrated PDMS Bumps".IEEE Electron Device Letters PP.99(2023):1-1.
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