中文版 | English
Title

Investigation of On-Wafer ESD Characteristics (HBM and TLP) of Lateral GaN-on-Si SBDs

Author
Publication Years
2023
DOI
Source Title
ISSN
1557-9646
VolumePPIssue:99Pages:1-4
Keywords
URL[Source Record]
SUSTech Authorship
First
ESI Research Field
ENGINEERING
Data Source
IEEE
PDF urlhttps://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10298254
Citation statistics
Document TypeJournal Article
Identifierhttp://kc.sustech.edu.cn/handle/2SGJ60CL/582742
DepartmentDepartment of Electrical and Electronic Engineering
Affiliation
Department of Electronic and Electrical Engineering, Southern University of Science and Technology, Shenzhen, China
First Author AffilicationDepartment of Electrical and Electronic Engineering
First Author's First AffilicationDepartment of Electrical and Electronic Engineering
Recommended Citation
GB/T 7714
Jiawei Chen,Junbo Liu,Wensong Zou,et al. Investigation of On-Wafer ESD Characteristics (HBM and TLP) of Lateral GaN-on-Si SBDs[J]. IEEE Transactions on Electron Devices,2023,PP(99):1-4.
APA
Jiawei Chen,Junbo Liu,Wensong Zou,&Jun Ma.(2023).Investigation of On-Wafer ESD Characteristics (HBM and TLP) of Lateral GaN-on-Si SBDs.IEEE Transactions on Electron Devices,PP(99),1-4.
MLA
Jiawei Chen,et al."Investigation of On-Wafer ESD Characteristics (HBM and TLP) of Lateral GaN-on-Si SBDs".IEEE Transactions on Electron Devices PP.99(2023):1-4.
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