| Title | Electrical and mechanical reliability and failure mechanism analysis of electrically conductive adhesives |
| Author | |
| Corresponding Author | Li, Fuquan; Chen, Hongtao |
| Publication Years | 2023-12-01
|
| DOI | |
| Source Title | |
| ISSN | 0026-2714
|
| EISSN | 1872-941X
|
| Volume | 151 |
| Abstract | For electrically conductive adhesives (ECAs) interconnection, adequate electrical, mechanical and thermal performance are crucial for long-term service reliability. The work focused primarily on analyzing the effects of environmental aging on the reliability and failure mechanism of ECAs joints. In this paper, high temperature and humidity (85 degrees C, 85%RH, 1000 h), thermal shock (-40 degrees C to 125 degrees C, 1000 cycles) and thermal aging (125 degrees C, 1000 h) tests were performed to study the reliability of the ECAs. Additionally, the fracture modes were investigated by mechanical shear strength testing before and after the reliability tests. The interfacial microstructure of the ECAs was investigated and the fracture mechanism of ECAs was characterized. The study showed that the reliability of the ECAs was improved compared with conventional ECA1 and ECA2. |
| Keywords | |
| URL | [Source Record] |
| Indexed By | |
| Language | English
|
| SUSTech Authorship | Others
|
| Funding Project | Stable Support Program for Higher Education Institutions of Shenzhen[GXWD20220818163456002]
; Project of Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory["ZHD202210-016","ZHD202209-018"]
|
| WOS Research Area | Engineering
; Science & Technology - Other Topics
; Physics
|
| WOS Subject | Engineering, Electrical & Electronic
; Nanoscience & Nanotechnology
; Physics, Applied
|
| WOS Accession No | WOS:001088750300001
|
| Publisher | |
| ESI Research Field | ENGINEERING
|
| Data Source | Web of Science
|
| Citation statistics | |
| Document Type | Journal Article |
| Identifier | http://kc.sustech.edu.cn/handle/2SGJ60CL/582806 |
| Department | Department of Materials Science and Engineering |
| Affiliation | 1.Harbin Inst Technol Shenzhen, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China 2.Harbin Inst Technol Shenzhen, Sauvage Lab Smart Mat, Shenzhen 518055, Peoples R China 3.Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China 4.Beijing Santel Technol & Trading Corp, Beijing 100039, Peoples R China 5.China Elect Prod Reliabil & Environm Testing Res I, Guangzhou 510610, Peoples R China 6.Harbin Inst Technol, Dept Mat Sci & Engn, Harbin 150001, Peoples R China |
| Recommended Citation GB/T 7714 |
Zhang, Weiwei,Yao, Zhijun,Liu, Hao,et al. Electrical and mechanical reliability and failure mechanism analysis of electrically conductive adhesives[J]. MICROELECTRONICS RELIABILITY,2023,151.
|
| APA |
Zhang, Weiwei.,Yao, Zhijun.,Liu, Hao.,Liu, Jiahao.,Li, Mingyu.,...&Chen, Hongtao.(2023).Electrical and mechanical reliability and failure mechanism analysis of electrically conductive adhesives.MICROELECTRONICS RELIABILITY,151.
|
| MLA |
Zhang, Weiwei,et al."Electrical and mechanical reliability and failure mechanism analysis of electrically conductive adhesives".MICROELECTRONICS RELIABILITY 151(2023).
|
| Files in This Item: | There are no files associated with this item. | |||||
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
;
Edit Comment